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Highly viscous conductive silver paste

A technology of conductive silver paste and silver powder, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, nanotechnology, nanotechnology for materials and surface science, etc., can solve the problems of poor hardness of high polymers, and achieve excellent Conductive performance, unique design, reasonable composition effect

Inactive Publication Date: 2019-01-11
沈丽娟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conductive silver powder is a metal powder with relatively high hardness, but the hardness of high polymers such as resin is generally poor
And the existing conductive silver paste has no adhesion

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0012] 72% flake silver powder, 10% nanometer silver powder, 19% thermoplastic polyimide resin, 50% chitin and 1% triterpene saponin.

[0013] Example

[0014] 60% flake silver powder, 1% nanometer silver powder, 14% thermoplastic polyimide resin, 30% chitin and 0.6% triterpene saponin.

[0015] Example

[0016] 68% flake silver powder, 8% nanometer silver powder, 16% thermoplastic polyimide resin, 35% chitin and 0.8% triterpene saponin.

[0017] The beneficial effects of the present invention are: the present invention is unique in design, reasonable in composition, convenient in preparation, has excellent electrical conductivity, and has good adhesion to the base material, while improving the electrical conductivity and mechanical properties of the coating, it ensures the adhesiveness of the coating, Ease of processing, hardness, diffusivity, and low environmental pollution.

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PUM

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Abstract

The invention relates to the technical field of silver paste, in particular to a highly viscous conductive silver paste, comprising the following components in parts by mass: flake silver powder 60-72%, nanometer silver powder 1-10%, thermoplastic polyimide resin 14-19%, chitin 30%-50% and triterpenoid saponin 0. 6%-1%. The invention is unique in design, reasonable in composition, convenient in preparation, excellent in electrical conductivity and very adhesive.

Description

technical field [0001] The invention relates to a silver paste, in particular to a strong adhesive conductive silver paste. Background technique [0002] As a functional printing material, conductive paste has been widely used in electronic information products due to its good physical properties. With the development of electronic products to be lighter, thinner, more functional and more environmentally friendly, its Performance also puts forward higher requirements. Among them, the low-temperature halogen-free conductive silver paste is widely used in membrane switches, capacitive electrodes, touch screens, etc. because of its excellent electrical conductivity, thermal conductivity, and practicability. Low-temperature conductive silver paste is a uniform paste made by stirring and dispersing conductive silver powder as a conductive filler with high polymer resin, solvent, curing agent, and additives. After the conductive silver paste is coated on the substrate, it is dri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22B82Y30/00
CPCH01B1/22B82Y30/00
Inventor 沈丽娟
Owner 沈丽娟