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A kind of solderable low temperature drying silver paste and preparation method thereof

A low-temperature drying, silver paste technology, applied in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, electrical components, etc., can solve the problems of difficult welding technology and poor practicability.

Active Publication Date: 2020-07-07
湖南省国银新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a weldable low-temperature drying silver paste and a preparation method thereof, which are used to overcome the shortcomings of existing products such as difficult welding technology and poor practicability, realize the solderability of the conductive layer, and improve the low-temperature drying silver paste. Availability of pulp

Method used

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  • A kind of solderable low temperature drying silver paste and preparation method thereof
  • A kind of solderable low temperature drying silver paste and preparation method thereof
  • A kind of solderable low temperature drying silver paste and preparation method thereof

Examples

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Embodiment 1

[0027] Please refer to figure 1 , the present invention provides a solderable low-temperature drying silver paste, the composition of which includes in parts by mass: 90-95 parts of silver powder, 3-10 parts of nano-silica sol; the solderable low-temperature drying silver paste is coated on the substrate In the process of drying the surface and forming a conductive layer under low temperature conditions, when the water in the nano-silica sol evaporates, the nano-silica sol particles are attached to the surface of the silver particles, and silicon particles are formed between the silver particles and between the silver particles and the matrix. Oxygen-bonded and high-temperature solder-resistant silicone gel layer.

[0028] In a preferred embodiment of the present invention, 5 parts of nano-silica sol and 95 parts of silver powder are mixed and stirred evenly to obtain solderable low-temperature drying silver paste.

[0029] In another preferred embodiment of the present inven...

Embodiment 2

[0043] Please refer to figure 2 , On the basis of Embodiment 1, the embodiment of the present invention provides a method for preparing a solderable low-temperature drying silver paste, comprising the following steps:

[0044] Step S1, weighing 90-95 parts of silver powder and 3-10 parts of nano-silica sol according to the parts by mass;

[0045] Step S2, adding the nano-silica sol to the silver powder;

[0046] Step S3, stirring evenly to obtain silver paste.

Embodiment 3

[0048] see image 3 , On the basis of Embodiment 1, the embodiment of the present invention provides another preparation method of solderable low-temperature drying silver paste, comprising the following steps:

[0049] Step S10, weighing 90-95 parts of silver powder, 3-10 parts of nano-silica sol and 1-5 parts of mirror resin according to the parts by mass;

[0050] Step S20, mixing the nano-silica sol and the mirror resin evenly and then adding it to the silver powder;

[0051] Step S30, stirring evenly to obtain silver paste.

[0052] Preferably, the mirror surface resin includes a styrene-acid modified resin, the nano-silica sol is an ethanol solvent-based silica sol, and the silver powder consists of 90-95 parts by mass of micron-sized silver powder and 5 parts by mass of nano-sized silver powder. ~10 parts.

[0053] The paste with strong printing adaptability can obtain high-conductivity low-temperature drying silver paste after curing, with strong adhesion, and the c...

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Abstract

The invention discloses a solderable low-temperature drying silver paste and a preparation method thereof. The silver paste comprises the following parts by mass: 90-95 part of silver powder and 3-10parts of nano silica gel sol. The preparation method of solderable low-temperature drying silver paste comprises the following steps: weighing 90-95 parts of silver powder and 3-10 parts of nano-silica sol according to the mass parts; Adding nano silica sol into silver powder; uniformly stirring the mix to obtain the silver paste. The method solves the problems that the conductive layer in the prior art is not solderable and the practicality is not strong, realizes the solderability of the conductive layer, and improves the practicality of the conductive layer formed by the low-temperature drying silver paste.

Description

technical field [0001] The invention relates to the technical field of conductive paste, in particular to a solderable low-temperature drying silver paste and a preparation method thereof. Background technique [0002] The silver paste can be roughly divided into three categories according to the drying temperature range: the first category, high-temperature silver paste, which is dried and sintered at a high temperature of 750-850°C, so that the silver particles are sintered and densified; Drying and sintering at a medium temperature of 400-650°C to sinter and densify the silver particles; the third type is to dry at a temperature below 200°C and solidify and bond to the substrate through polymer resin, and the silver particles are bonded together by van der Waals force . [0003] The existing low-temperature drying silver paste is usually formed by mixing silver powder and polymer resin material. A layer of silver paste is brushed on the substrate. After drying, a conduct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/02H01B1/22H01B13/00
CPCH01B1/02H01B1/22H01B13/00
Inventor 杨华荣严红革刘宵陈实李蓉
Owner 湖南省国银新材料有限公司