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Coating technology for water-based hot melt adhesive tape

A coating process, hot melt adhesive technology, applied in the direction of adhesives, heat-activated films/sheets, film/sheet-like adhesives, etc., can solve the problems of uneven adhesive layer, stickiness, etc., and achieve uniform thickness of the adhesive layer stable effect

Active Publication Date: 2019-01-25
JIANGSU KEMAITE TECH DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, it is necessary to realize water-based hot melt adhesive coating on the existing three-roll coater, but after the water-based hot-melt adhesive is coated on the three-roll coater, the adhesive layer has problems such as unevenness and stickiness

Method used

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  • Coating technology for water-based hot melt adhesive tape
  • Coating technology for water-based hot melt adhesive tape
  • Coating technology for water-based hot melt adhesive tape

Examples

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Embodiment Construction

[0043] Attached below figure 1 , and further illustrate the technical solution of the present invention through specific embodiments.

[0044] The schematic flow sheet of the coating process of water-based hot-melt adhesive tape of the present invention is as figure 1 As shown, the substrate 1 is unwinding and running, and the substrate is pressed down by the pressing roller 2, so that the substrate is concave downward during operation, and the running direction of the pressing roller in contact with the substrate is the same as that of the substrate. The running direction is consistent and forms an included angle, which is convenient for glue application after contact with the upper rubber roller. Turn the rubber transfer roller 3, and the water-based hot melt glue in the glue tank 6 will be transferred from the rubber transfer roller 3 to the upper rubber roller 4. By adjusting the upper rubber roller The gap between the rubber roller 4 and the metering roller 5 is used to ...

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Abstract

The invention provides a coating technology for water-based hot melt adhesive tape. The coating technology comprises the following steps that 1) a base material is unwound, the running base material is pressed downwards by adopting a compression roller, and an included angle is formed between the running direction of the position, making contact with the base material, of the compression roller and the running direction of the base material; 2) an adhesive transferring roller is rotated to transfer a water-based hot melt adhesive to a coating roller, and the coating roller is used for coatingthe base material; 3) hot air drying is carried out on the base material subjected to coating in the step 2) through a drying tunnel, so that moisture is volatilized, wherein four-stage temperature control is carried out in the drying tunnel; and 4) the base material subjected to coating in the step 3) is wound so as to obtain the water-based hot melt adhesive tape. The coating technology for thewater-based hot melt adhesive tape has the advantages of being simple, safe and non-toxic, an adhesive layer is uniform and stable in thickness, winding and unwinding are natural, adhesion is avoided,the water-based hot melt adhesive tape has the appearance quality and the adhesive property which are equivalent to those of a film prepared through a solvent-type hot melt adhesive coating technology, the energy consumption is low, the efficiency is high, and an existing solvent-type hot melt adhesive product can be replaced.

Description

technical field [0001] The invention belongs to the technical field of hot-melt tape processing, and relates to a coating process of water-based hot-melt tape. Background technique [0002] Hot-melt adhesive is an adhesive that has no viscosity or low viscosity at room temperature, but becomes sticky after heating. Hot-melt tape is made of traditional hot-melt adhesive by extrusion or coating into a tape type product , while retaining the characteristics of hot melt adhesives, it also has the advantages of easy die-cutting and sizing. In the glue sizing process, it is only necessary to preheat the adherend and press it with the tape to achieve bonding. No special hot glue equipment is needed, and it can also be heated and bonded after alignment, which greatly reduces the difficulty of processing. , Improve the yield rate, welcomed by the majority of electronic processing manufacturers. [0003] CN108250993A discloses a formulation and preparation method of a substrate-free...

Claims

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Application Information

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IPC IPC(8): C09J7/25C09J7/35C09J123/04C09J11/06C09J11/08
CPCC09J11/06C09J11/08C09J123/04C09J7/255C09J7/35C09J2301/122C08L91/06C08K5/13C08K5/05
Inventor 虞家桢
Owner JIANGSU KEMAITE TECH DEV CO LTD
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