Degradable epoxy resin modified by helical ring acetal, and preparation method and application thereof
A technology of epoxy resin and cyclic acetal, which is applied in the field of degradable epoxy resin modified by spiral ring acetal and its preparation, which can solve the difficulty of epoxy resin purification, the difference in processing performance, and the long cycle of epoxy resin, etc. Problems, to achieve the effect that is conducive to large-scale industrial production, good performance, and easy implementation
Active Publication Date: 2019-01-29
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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Problems solved by technology
[0005] Japanese Tamotsu Hashimoto et al. (Journal of Polymer Science Part a-Polymer Chemistry 2012, 50, 3674-3681) introduced the acetal structure using a vinyl ether compound containing epoxy groups, which is complicated to synthesize, and the epoxy resin is purified simultaneously. Difficult, need to use the method of the pillar, the cycle is long
[0006] The epoxy resin prepared by Christopher K.Ober et al. (Chemistry of Materials 1998,10,1475-1482.) in the United States has great differences in structure, resulting in differences in processing performance and traditional resins
[0007] However, the cycle of synthesizing new epoxy resins is relatively long. At the same time, the synthetic resins are different from traditional resins in processing performance, and the possibility of replacing traditional epoxy resins in the short term is relatively small.
Method used
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Embodiment 1
[0052] 100g bisphenol A type epoxy resin (DER331, epoxy equivalent 182~192g / mol), 52g helical ring acetal bisphenol A, 0.5g tetrabutylammonium bromide, mechanical stirring reaction at 100°C for 2 hours, namely Spiral Ring Acetal Modified Epoxy Resins 1.
Embodiment 2
[0054]100g bisphenol S-type epoxy resin (epoxy equivalent 790g / mol), 8g spirocyclic acetal bisphenol B, 4g 1,8-diazabicycloundec-7-ene, mechanical stirring reaction at 120°C After 0.5 hour, the spirocyclic acetal modified epoxy resin 2 was obtained.
Embodiment 3
[0056] 100g of diglycidyl phthalate, 80g of helical ring acetal bisphenol A, 6g of tetrabutylammonium bromide, and react with mechanical stirring at 60°C for 24 hours to obtain the helical ring acetal modified epoxy resin 3.
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Abstract
The invention discloses degradable epoxy resin modified by helical ring acetal, and a preparation method and an application thereof. The degradable epoxy resin includes, by mass, 100 parts of epoxy resin, 8-80 parts of helical ring acetal diphenol, and 0-6 parts of a catalyst. The components are uniformly mixed and are reacted at 60-160 DEG C for 0.5-24 hours. The degradable epoxy resin, when being cured, can be degraded in a quite gentle condition, so that a fiber composite material prepared from the epoxy resin allows the fibers to be easily recovered, wherein the recovered fibers can hold the quality of the original fibers.
Description
technical field [0001] The invention relates to the field of polymers and composite materials, in particular to a degradable epoxy resin modified by a helical ring acetal and its preparation method and application. Background technique [0002] Epoxy resin is one of the three general-purpose thermosetting resins. It is an insoluble and infusible polymer material with a three-dimensional network structure obtained through chemical crosslinking. It has excellent thermodynamic properties and dimensional stability. It is used in high-performance coatings, Adhesives, composite materials, electronic packaging materials and other fields are widely used, and it is difficult to replace them with thermoplastic materials. The global annual output of epoxy resin is about 3 million tons. [0003] However, due to the covalently cross-linked network structure, traditional epoxy resins cannot be reshaped or reprocessed by heating and solvent dissolution, and are more difficult to recycle. ...
Claims
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Login to View More IPC IPC(8): C08G59/14C08J5/24C08L63/00
CPCC08G59/1438C08J5/24C08J2363/00
Inventor 马松琪朱锦
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI



