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Single-ingredient epoxy resin conductive bonding agent and preparation method thereof

An epoxy resin, one-component technology, applied in the field of conductive adhesive, can solve the problems of long time required for conductive adhesive reaction, insufficient rapid curing, insufficient release curing agent, etc.

Inactive Publication Date: 2019-02-12
CHANGCHUN YONGGU TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the use of the microcapsule curing agent in the prior art, due to the incomplete rupture of the microcapsules during curing and the insufficient release of the curing agent after the capsule ruptures, the time required for the reaction of the conductive adhesive is longer and the rapid curing is not sufficient. And other issues

Method used

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  • Single-ingredient epoxy resin conductive bonding agent and preparation method thereof
  • Single-ingredient epoxy resin conductive bonding agent and preparation method thereof
  • Single-ingredient epoxy resin conductive bonding agent and preparation method thereof

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preparation example Construction

[0080] The present invention also provides a preparation method of a one-component epoxy resin conductive adhesive, comprising the following steps:

[0081] Step 1, the general formula of microcapsule wall material structure is the preparation of the polymer of a3, b3 or c3

[0082] Step 1-1, dissolve 3-hydroxymethyl-2 nitrobenzyl alcohol a1 or 4-hydroxymethyl-2 nitrobenzyl alcohol b1 or 5-hydroxymethyl-2 nitrobenzyl alcohol c1 in dry Dichloromethane or chloroform solvent is used to make a solution with a mass fraction of 0.1-10%. The solution is added to a three-necked flask equipped with a stirrer, and then the 4-dimethylaminopyridine catalyst is added. After stirring evenly, triethyl After amine, add 2-bromo-2-methyl-propionyl bromide dropwise, stir at room temperature, react for 20-30 hours, quench the reaction with methanol, dilute the reaction solution with tetrahydrofuran solvent, use 200-500 mesh basic silica gel or alkali Filter the triethylamine hydrochloride by usi...

Embodiment 1

[0114] Embodiment 1 takes microcapsule curing agent 1 as the conductive adhesive of component

[0115] Microcapsule curing agent 1: with It is the capsule material, and diaminodiphenyl sulfone is the microcapsule curing agent for the core material.

[0116] Preparation of polymer a-1

[0117] In a three-neck flask equipped with a stirrer, dissolve 183 mg of 3-hydroxymethyl-2-nitrobenzyl alcohol (a1) in 90 mL of dry dichloromethane, and then add 1.83 mg of 4-dimethylaminopyridine. After stirring evenly, after adding 3 mg of triethylamine, 459.8 mg of 2-bromo-2-methyl-propionyl bromide was added dropwise, stirred at room temperature, reacted for 20 hours, and quenched the reaction with 18 mL of methanol. Add 10 mL of tetrahydrofuran solvent to the reaction solution, filter triethylamine hydrochloride with 200 mesh basic aluminum oxide, drop the filtrate into diethyl ether, precipitate precipitate, filter with Buchner funnel, and wash with deionized water several times, After...

Embodiment 2

[0127] Embodiment 2 is the conductive adhesive of component with microcapsule curing agent 2

[0128] Microcapsule curing agent 2: with It is the capsule material, and diaminodiphenyl sulfone is the microcapsule curing agent for the core material.

[0129] Preparation of polymer a-2

[0130] In a three-neck flask equipped with a stirrer, dissolve 183 mg of 3-hydroxymethyl-2-nitrobenzyl alcohol (a1) in 90 mL of dry dichloromethane, and then add 1.83 mg of 4-dimethylaminopyridine. After stirring evenly, after adding 3 mg of triethylamine, 459.8 mg of 2-bromo-2-methyl-propionyl bromide was added dropwise, stirred at room temperature, reacted for 20 hours, and quenched the reaction with 18 mL of methanol. Add 10 mL of tetrahydrofuran solvent to the reaction solution, filter triethylamine hydrochloride with 200 mesh basic aluminum oxide, drop the filtrate into diethyl ether, precipitate precipitate, filter with Buchner funnel, and wash with deionized water several times, After ...

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Abstract

The invention belongs to the technical field of a conductive adhesive, and particularly relates to a single-ingredient epoxy resin conductive bonding agent and a preparation method thereof. A curing agent used in the single-ingredient epoxy resin conductive bonding agent is a photosensitive microcapsule curing agent using novel structure degradable polymers as microcapsule wall materials and usingcuring agents as capsule core materials. The microcapsule wall materials can degrade under the wavelength of 200 to 400 nm to release the curing agent for curing epoxy resin; the problems of long time required by system reaction, insufficient fast curing performance and the like caused by the fact that in the prior art, in the epoxy resin curing reaction using microcapsule potential curing agent,the microcapsule cracking is incomplete during the curing, the curing agent release after the capsule cracking is insufficient and the like can be solved. The horizontal shearing force of the single-ingredient epoxy resin conductive bonding agent is 20 to 22 MPa; the volume resistivity is 5*10<-5> to 8*10<-5> Ohm.cm; the viscosity is 10010 to 14510 cP. The conductive adhesive provided by the invention has the advantages that the curing reaction time is obviously shortened; the fast curing can be realized.

Description

technical field [0001] The invention belongs to the technical field of conductive adhesives, and in particular relates to a single-component epoxy resin conductive adhesive and a preparation method thereof. Background technique [0002] Traditional conductive connections generally use metal welding, and metal welding requires a relatively high temperature, especially after using lead-free soldering, the welding temperature has increased by more than 30°C compared to the original. High temperature welding will lead to material deformation, damage to components, stress concentration, loss and leakage of electromagnetic signals, etc. In addition to meeting the two most basic requirements of conductivity and bonding, conductive adhesives also have many advantages, such as being able to cure at lower temperatures or even room temperature, avoiding the above shortcomings of metal welding. Due to the miniaturization and miniaturization of electronic components and the rapid develo...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/02C08G59/50
CPCC08G59/504C08K2003/0806C09J9/02C09J163/00C08K3/08
Inventor 张强王群宫春玥刘姝郑岩徐丽爽陈学进李永丰
Owner CHANGCHUN YONGGU TECH