Bonding device and method for directly bonding hydrophilic discs

Abstract

The invention discloses a bonding device and method for directly bonding a hydrophilic discs. The device comprises a machine frame, a rotary table assembly, a stop block clamp assembly, a water supplyand drainage system, an upper cover and a pressure application device, wherein the machine frame comprises supporting frames and a cylinder body; the upper cover capable of opening and closing is mounted at an upper end port of the cylinder body; the pressure application device is mounted on the upper cover; the rotary table assembly comprises a rotary table, a driving motor and a rotary shaft; the rotary shaft is arranged on the supporting frame in a rotary manner; the lower end of the rotary shaft is connected with an output shaft of the driving motor; the rotary table is mounted at the upper end of the rotary shaft; the stop block clamp assembly is arranged on the rotary table; and the water supply and drainage system comprises a water inlet pipe and a water outlet pipe. The device fordirectly bonding the hydrophilic discs is simple in structure, convenient to operate, low in cost, and is suitable for laboratory research. The disc bonding quality can be obviously improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, relates to the technical field of wafer direct bonding devices, and particularly relates to a bonding device and method for direct bonding of hydrophilic wafers. Background technique [0002] The wafer direct bonding technology refers to the fact that the atoms at the bonding interface of the two wafers undergo a physical and chemical reaction under the action of external energy to form a covalent bond without any binder and intermediary layer. And achieve a certain bonding strength micro-processing technology. As an important semiconductor manufacturing technology, this technology has very broad application prospects in product packaging, device integration and material preparation. The direct wafer bonding technology has high requirements on the surface quality of the bonded wafers. Generally, the bonded wafers need to be cleaned before bonding to remove various pollutants ...

AI Technical Summary

Problems solved by technology

[0003] At present, the direct bonding technology of wafers used in industry requires special automatic bonding equipment, which is mainly used for mass production, which is expensive and has more restrictions on the materials of the wafers to be bonded.

In the laboratory research and development stage of bonding technology, researchers usually need to carry out hand-held operations on the wafer to complete the various procedures of the bonding process, and the laboratory environment often cannot meet the specific cleanliness. High potential for re-contamination of the cleaned wafer surface, adversely affecting bond quality

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