Multi-chip package interconnection structure and multi-chip package interconnection method

Abstract

The invention discloses a multi-chip package interconnection structure, which comprises a first substrate and a second substrate which are superposed, wherein a plurality of first cavities are arranged on the first substrate; a plurality of first chips are arranged in the first cavities; the first surface of the first substrate is provided with a first pad; the first pad is electrically connectedto the first chips; a plurality of second cavities are formed in the second substrate; a plurality of second chips are arranged in the second cavities; the upper surface of the second substrate is provided with a second pad; the second pad is electrically connected to the second chips; the first pad and the second pad are electrically connected by a conductive medium penetrating the second substrate. The multi-chip package interconnection structure disclosed by the invention adopts a direct soldering method to realize the vertical interconnection of the substrates, so that multi-chip package is high in integration degree, good in reliability, simple in process and low in cost; microwave radio frequency signal insertion loss does not exceed 0.5 dB, which can solve the problem of high-density vertical interconnection of the substrates; and the multi-chip package interconnection structure is widely used in a multi-chip package system of a radio frequency microwave circuit.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a multi-chip package interconnection structure and a multi-chip package interconnection method. Background technique [0002] With the rapid development of communication technology, VLSI technology, new electronic material technology and packaging and interconnection technology, modern military and civilian electronic equipment is developing in the direction of miniaturization, light weight, high reliability, multi-function and low cost. System-level three-dimensional packaging technology can contain multiple functions such as digital, analog, and radio frequency in a single package, which greatly reduces the volume and weight of the system. [0003] The key technology of 3D system-in-package lies in how to realize the vertical interconnection of the upper and lower layers of planar circuits. Vertical interconnection refers to the interconnection between signal layers, power...

AI Technical Summary

Problems solved by technology

The use of BGA solder ball interconnection has the advantages of good consistency, high integration density, and short interconnection length, but its manufacturing process is very complicated, resulting in high product costs, and it is difficult to effectively verify the reliability

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