A kind of preparation method of physical metamorphic semi-solid die-casting of high thermal conductivity baking pan
A high thermal conductivity, semi-solid technology, applied in the field of baking pan manufacturing technology, can solve problems such as copper precipitation, achieve the effect of small crystal nucleus, avoid the use of ultra-high pressure, and uniform heat transfer
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0035] In a preferred embodiment of the present invention, the physical modification semi-solid die-casting preparation method of the high thermal conductivity bakeware includes:
[0036] a. Put 40-60wt% of the total amount of aluminum alloy ingot into the melting furnace for melting, rapidly raise the temperature to 900-920°C, keep it for 15-20min, and the heating rate is 4~5°C / min;
[0037] b. Put the remaining aluminum alloy ingot into another melting furnace for melting, control the melting temperature at 640-660°C, and keep it warm for 0.5-1h;
[0038] c. Pour the molten aluminum in step a into the molten aluminum in step b to carry out metamorphic treatment;
[0039] d. Add the Al-5B alloy to the molten aluminum after the metamorphic treatment in step c, and keep it warm for 0.2-0.5h;
[0040] e. Add the Al-10Sr alloy to the molten aluminum obtained in step d, and keep it warm for 0.2-0.5h;
[0041] f. Refining, degassing and slag removal of molten aluminum;
[0042...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com