A method for testing electrical parameters of storage media and wafer-level integrated circuits

A technology of electrical parameters and integrated circuits, applied in the direction of circuits, semiconductor/solid-state device testing/measurement, electrical components, etc., can solve the problem of improving test efficiency without substantial contribution, unable to meet the urgent needs of high-speed measurement, and unavoidable unified testing Structural testing and other issues to achieve the effect of improving test efficiency, shortening test time, and improving service life
CN109411380BActive Publication Date: 2020-11-17杭州广立测试设备有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
杭州广立测试设备有限公司
Publication Date
2020-11-17

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Abstract

The invention relates to a storage medium and a testing method for the electrical parameter of a wafer-level integrated circuit. The testing method for the electrical parameter of the wafer-level integrated circuit comprises the following steps that: a) according to the electrical parameter of a structure to be tested and environment parameters required for testing, dividing test plan groups, anddividing test plans which have the same electrical parameter of the structure to be tested and the same environment parameters required for testing into one group; b) reading and configuring the environment parameter of the current test plan group; c) testing the electrical parameters of each testing structure in the current test plan group one by one; d) judging whether other test structures which are not tested are in the presence in the current test plan group or not; and e) judging whether other test groups which are not tested are in the presence or not. By use of the testing method, according to the type of the electrical parameter to be tested and the difference of the environment parameters, the test plans are classified, and testing efficiency is obviously improved.
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Description

technical field

[0001] The present invention relates to the field of integrated circuit industry chain, in particular to a storage medium and a method for testing electrical parameters of wafer-level integrated circuits. Background technique

[0002] In the integrated circuit industry chain, integrated circuit testing is an important step throughout the entire process of integrated circuit production and application. In the production cycle of a wafer, it goes through dozens or even hundreds of different processes. The deviation of any process step in the whole manufacturing process will affect the yield, which makes the yield of the finished wafer very high. great uncertainty. In addition, the investment in integrated circuit manufacturing is huge. An ordinary production line often costs hundreds of millions of dollars, and the cost of advanced production lines is even higher. Therefore, in order to improve the chip maturity cycle and save manufacturing costs, it is neces...

Claims

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