Laminating method of thin-film display and flexible circuit board, and laminating device thereof

Abstract

The invention discloses a laminating method of a thin-film display and a flexible circuit board, and a laminating device thereof. A hollow channel is arranged at one side of a porous sorption platformof the laminating device, and a thin-film display is adsorbed at the top of the porous sorption platform through a sorption plane, and a working platform is arranged at the outside of the porous sorption platform of the adjacent channel and used for placing the flexible circuit board, so that one butt-joint side of the flexible circuit board extends to above one signal transmission side of the thin-film display, and anisotropic conductive adhesive is arranged between the signal transmission side and the butt-joint side, namely, thermal pressurizing modules at the upper side and the lower sideof the channel at one side of the porous sorption platform are respectively propped against the butt-joint side and the signal transmission side by using an upper pressurizing head and a lower pressurizing head, thereby heating and laminating the anisotropic conductive adhesive, and achieving the aim of performing thermal lamination at the same or different temperature by adjusting the upper pressurizing head and the lower pressurizing head.

Description

technical field [0001] The invention provides a lamination method and a lamination device of a film display and a flexible circuit board, especially a lamination device and a lamination method capable of adjusting the heat lamination temperature of a heating and pressurizing module, for the film display The signal transmission side and the docking side of the flexible circuit board are accurately aligned and electrically combined to achieve the purpose of accelerating the thermocompression operation. Background technique [0002] Screens such as CRT televisions or cathode ray tube monitors (Cathode raytube) that are traditionally used to display video and audio signals are quite inconvenient to carry or install due to the large size and heavy weight of traditional screens. With the continuous advancement of technology, Audio-visual displays have been developing in the direction of thinning, planarization, and light weight. Various liquid crystal displays, light-emitting diod...

AI Technical Summary

Problems solved by technology

[0004] In addition, the thin film display A may use plastic materials (such as various films such as PI, PET, or PE) as the upper and lower substrates, and when the thin film display A and the flexible circuit board C are subjected to thermal compression processing, it may cause the plastic on the , Warpage and arc bending of the lower substrate due to heat, which affect the deviation of the alignment accuracy when the transmission interface A1 and the connection interface C1 are pressed together, resulting in an increase in the defective rate of the product. In the actual operation process, there are many deficiencies

[0005] Therefore, how to solve the problems and troubles that the different thermal expansion ratios between different materials affect the transmission interface and the size change of the connection interface when the thin film display and the flexible circuit board are processed by heat compression, and it is easy to cause the thin film display and the flexible circuit board. When the plastic substrate is thermally deformed and affects the thermocompression operation, the lack and troubles of the alignment accuracy deviation of the transmission interface and the connection interface, etc., are the directions that relevant manufacturers engaged in this industry are eager to study and improve.

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