Preparation method of aluminum nitride powder with dense morphology

Abstract

The invention relates to the technical field of preparation of inorganic non-metallic powder, specifically to a preparation method of aluminum nitride powder with the dense morphology. The preparationmethod comprises the following specific steps: uniformly mixing aluminum powder and a diluent in a certain proportion, putting an obtained mixture together with a small amount of an additive into a graphite ark, and performing a nitriding reaction in a vacuum sintering furnace, wherein the nitriding temperature is 800-1500 DEG C; performing compression moulding on fully nitrided aluminum nitridepowder, and then performing high-temperature treatment to optimize the morphology to obtain the aluminum nitride powder with the dense morphology. The large-diameter and dense-grained aluminum nitridepowder, as a filler, can significantly increase the heat conductivity coefficients of a heat-conducting adhesive, heat-conducting silicone grease and the like, and has a huge application prospect inthe heat dissipation field of high-power devices, circuit substrates, LED heat dissipaters, heat generators and the like.

Description

technical field [0001] The invention belongs to the technical field of inorganic non-metallic powder preparation, and in particular relates to a preparation method of aluminum nitride powder with dense appearance. Background technique [0002] As electronic products gradually tend to be miniaturized, high-density, and high-performance, their working environment temperature also tends to develop in the direction of high temperature. Data show that the reliability of electronic components decreases by 10% for every 2°C increase in temperature, so heat dissipation is one of the key factors for highly integrated electronic components. Ordinary silica gel has poor thermal conductivity, generally only about 0.2W / m·K. Filling high thermal conductivity fillers into organic polymer thermal adhesives is an economical and effective way to improve the thermal conductivity of silicone. In order to ensure the insulation performance of thermally conductive adhesives, metal oxides or meta...

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Problems solved by technology

But NH 4 The addition of Cl is easy to form loose, porous, needle-like and other shapes. The powder of these shapes is not easy to form an effective heat-conducting network chain as a thermally conductive filler, which affects the thermal conductivity of the finished product and even affects the preparation process of the thermally conductive adhesive.

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