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Novel high-capacity multi-level hybrid clamping topology and topological method

A hybrid clamping and topological structure technology, applied to electrical components, output power conversion devices, AC power input conversion to DC power output, etc.

Active Publication Date: 2019-03-15
SHENYANG POLYTECHNIC UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention proposes a novel large-capacity multi-level hybrid clamp topology and topology method, the purpose of which is to solve the problem of turn-off overvoltage of the devices inside the bridge arm in the common diode clamp NPC topology. Can provide a bidirectional path for current

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  • Novel high-capacity multi-level hybrid clamping topology and topological method
  • Novel high-capacity multi-level hybrid clamping topology and topological method
  • Novel high-capacity multi-level hybrid clamping topology and topological method

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Embodiment Construction

[0030] A new type of high-capacity multi-level hybrid clamp topology, which is a three-phase four-leg structure, adding a bridge arm to the traditional hybrid three-phase structure, which is specially used for clamping, and this structure No additional voltage balance circuit and independent DC voltage source are required, and the midpoint potential balance can be achieved by itself no matter what the load characteristics are; and the traditional clamping device has been improved, and the diode of the three-phase four-leg topology The clamping device is changed to a capacitor clamping device. By adding an active switch tube as a clamping device, this topology realizes a bidirectional current path and improves the problem of unbalanced capacitor voltage. The two ends of the level inverter increase the output level from four levels to five levels. S al and S a8 Also and clamp IGBT S c2 ,S c3 ,S c4 ,S c5 ,S c6 , S c7 Together to realize the DC bus capacitance C 1 ,C 2 ,...

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Abstract

The invention relates to a novel high-capacity multi-level hybrid clamping topology and a topological method. The structure is a three-phase four-bridge arm structure; one bridge arm is added based ona conventional hybrid three-phase structure and is specially used for clamping; further, the structure does not need a voltage balancing circuit and an independent DC voltage source, and can realizemidpoint potential balance under all load characteristics; the conventional clamping device is improved, namely, a diode clamping device with a three-phase four-bridge arm topology is transformed intocapacitor clamping; an active switch transistor is added as a clamping device, so that the topology realizes current bidirectional path, and solves a problem of imbalance capacitance and voltage. Thestanding voltage balance problem in power switch in series operation is solved, further, a better way for realizing high voltage energy control based on low withstand voltage power switch is provided.

Description

technical field [0001] The invention designs a novel hybrid clamp type multilevel converter, which belongs to the field of power electronic converters. Background technique [0002] The purpose of studying multi-level topology is to realize multi-level output voltage, so that the converter can be applied to higher voltage occasions and improve the output voltage harmonic performance. In order to solve the problem of simultaneous on and off of series devices, a new type of multilevel converter has been developed since the 1980s. Multilevel converters are divided into three basic types: diode clamp type, flying capacitor type and cascade type. As the number of levels increases, the number of clamping devices required doubles or even increases quadratically. In addition to increasing system cost and control complexity, a large number of devices means that the possibility of failure increases. Various voltage-type multilevel converters have been proposed one after another, and...

Claims

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Application Information

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IPC IPC(8): H02M7/487
CPCH02M7/487
Inventor 王湘明井庆阳邢作霞陈哲
Owner SHENYANG POLYTECHNIC UNIV
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