Supercharge Your Innovation With Domain-Expert AI Agents!

Method and curable compound for casting electronic components or component groups

A technology of electronic components and compositions, which is applied in the fields of electrical components, electric solid-state devices, semiconductor/solid-state device components, etc., can solve problems such as high cost, achieve the effect of small mechanical load and achieve the effect of integration density

Active Publication Date: 2019-03-15
ROBERT BOSCH GMBH
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this is associated with a corresponding complexity during production, which is costly and naturally requires significantly more assembly space than the electronic components themselves

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and curable compound for casting electronic components or component groups
  • Method and curable compound for casting electronic components or component groups
  • Method and curable compound for casting electronic components or component groups

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] In the first embodiment, SR368 was used as the acrylate component. Amino terminated polyethers with different chain lengths (Jeffamine D-400 and D-2000) and IPDA were used as amine components. Cycloaliphatic IPOX ER 15 is mixed into the formulation as an epoxy resin to bond the amine hardener. DBU was used to catalyze Michael addition. As a photoinitiator, Irgacure 819 was used to prepare a tensile test piece with a thickness of 2 mm, and Irgacure 184 was used to test the penetration depth of irradiation. The formulations of hardenable compositions thus obtained had the compositions given in the table below.

[0063] components

quantity

SR368

5g

IPOX ER 15

0.5g

Jeffamine D-2000

1g

Jeffamine D-400

0.7g

IPDA

0.85g

Irgacure 184 or 819

10mg

DBU

50mg

[0064] After filling the test piece mold, one half of the test piece was irradiated in UVA-CUBE 2000 for 2 minutes, and the other hal...

Embodiment 2

[0070] In the second embodiment, SR368 and SR833S were used as the acrylate component. Polyethers with different chain lengths (Jeffamine D-400 and D-2000) and IPDA were used as amine components. DGEBA is incorporated into the formulation as an epoxy resin to bond the amine hardener. DBU was used to catalyze Michael addition. Irgacure 819 was used as photoinitiator. The following formulations of hardenable compositions result from these ingredients:

[0071] components

quantity

SR368

1g

SR833S

4g

DGEBA

0.5g

Jeffamine D-2000

1g

Jeffamine D-400

0.7g

IPDA

0.85g

Irgacure 819

10mg

DBU

50mg

[0072] After filling the test piece mold, one half of the test piece was irradiated in UVA-CUBE 2000 for 5 minutes, and the other half was protected from light. All test pieces were subsequently hardened together in an oven at 110° C. for 2 hours and at 180° C. for 2 hours. In this case a ri...

Embodiment 3

[0076] In the third example, SR833S was used as the acrylate component. Priamine (mixture of aminated monomers, dimers and trimers of oleic acid; aliphatic backbone) and 2,2,4-trimethylhexane-1,6-diamine were used as amine components. As an epoxy resin, DGEBA is mixed in the formulation to bond the amine hardener. DBU was used to catalyze Michael addition. Irgacure 819 was used as photoinitiator. The following formulations of hardenable compositions result from these ingredients:

[0077] components

quantity

SR833S

5g

DGEBA

0.75g

Priamine 1075

0.74g

2,2,4-trimethylhexane-1,6-diamine

1.26g

Irgacure 819

10mg

DBU

50mg

[0078] After filling the test piece mold, one half of the test piece is irradiated in the UVA-CUBE 2000 for 5 minutes, and the other half must be protected from the light. All test pieces were subsequently hardened together in an oven at 110° C. for 2 hours, at 150° C. for 2.5 hour...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method for casting electronic components, wherein the components (1) are embedded in a casting compound (4) and the casting compound (4) is then cured via at least one cross-linking process. The invention further relates to a curable compound which can be used as a casting compound (4) in the method. The casting compound (4) contains at least one cross-linked component,which is homogeneously distributed in the casting compound (4) and can cross-link to at least two different cross-linked systems. A first of said cross-linked systems (8) has a higher cross-link density than a second network (7), wherein the cross-linking to the first cross-linked system (8) is triggered via a different event than the cross-linking to the second cross-linked system (7). When casting the components (1) or component groups, the at least one cross-linked component of the casting compound (4) is then cured at least in part to the first cross-linked system (8), in at least one first region (5), which is spaced apart from the components (1), and to the second cross-linked system (7) at least in one second region (6), which encloses and directly surrounds the components (1). Themethod enables the generating of a housing function for the electronic components (1) from the casting compound (4), while the interior of the casting compound (4) remains soft.

Description

technical field [0001] The invention relates to a method for casting an electronic component or component group, wherein the component or component group is embedded in a casting composition, and the casting composition is subsequently hardened via at least one crosslinking process. The invention also relates to hardenable compositions which can be used in the method as casting compositions. Background technique [0002] Casting electronic components is an important component in the manufacture of modern electronic systems. However, the choice of the correct casting composition currently requires a decision as to whether a softer or more rigid casting composition has to be used for the cast element. [0003] Soft casting compositions are able to compensate for stresses which occur during hardening or by shrinkage during temperature changes due to significantly different thermal expansion coefficients, for example. However, they generally do not provide sufficient protectio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/29H01L21/56H01L23/31C08F222/10
CPCH01L23/293H01L23/3135H01L21/56C08F222/103C08F2/44C08F2/48C08K5/0025C08K5/07C08K5/132C08K5/1515C08K5/5397C08F222/102H01B3/302
Inventor A·赖尔J·维泽尔J·斯彭格勒R·克莱因A·克赖肯鲍姆
Owner ROBERT BOSCH GMBH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com