Molding and machining method of loose ceramic parts

A technology for forming and processing ceramic parts, applied in the field of forming and processing loose ceramic parts, can solve problems such as cracks and easy chipping, and achieve the effects of high cutting accuracy, improved processing efficiency, and low processing costs
CN109483752AInactive Publication Date: 2019-03-19LUOYANG INST OF ELECTRO OPTICAL EQUIP OF AVIC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
LUOYANG INST OF ELECTRO OPTICAL EQUIP OF AVIC
Publication Date
2019-03-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a molding and machining method of loose ceramic parts. Through the tool design, stable machining is realized by matching and using the paraffin loose ceramic part, a high precision numerical control machine tool is used for improving the machining efficiency and surface quality of the parts, and the problem that the loose parts are prone to edge collapsing, cracking and other machining defects in the molding and machining. The molding and machining method of the loose ceramic part has the beneficial effects that a method of wax bonding is adopted to connect the parts with tools, non-stress clamping of the parts is realized through the clamping tools, the molding and machining of complicated loose ceramic materials with different configurations are met, and the lightweight requirements of the products are met; and compared with conventional cutting, high speed machining has the advantages of high cutting efficiency, high cutting precision, small cutting force and low machining costs, and the high efficiency and high quality machining of the loose ceramic materials is ensured.
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Description

technical field

[0001] The mechanical processing and manufacturing method of the invention relates to a molding and processing method of loose ceramic parts. Background technique

[0002] Ceramic materials have excellent physical properties, chemical properties and mechanical properties, and are widely used in aerospace and aviation fields. Taking SiC as an example, as a new type of wide-bandgap semiconductor material, it has many excellent physical and chemical properties, high thermal conductivity and low thermal expansion coefficient make SiC a good choice for making optical components and mechanical parts with good thermal deformation resistance. One of the best materials, and also one of the best optical mirror materials at present, will play an important role in improving the quality of future optical products.

[0003] In order to meet the requirements of use, ceramic materials need to be sintered at high temperatures, and at high temperatures, the solid particles of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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