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Inorganic far-infrared nano-coating material and coating process thereof

A coating process and nano-inorganic technology, applied in the field of coatings, can solve the problems of peeling, poor substrate adhesion, and poor coating flexibility, and achieve the effect of solving adhesion, not easy to crack, and high strength

Inactive Publication Date: 2019-03-19
安徽友瓷化工科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The natural advantage of inorganic film-forming materials is that the far-infrared effect is better than that of organic film-forming materials. High hardness, weather resistance, and high temperature resistance further enhance the advantages of inorganic film-forming materials in the field of far-infrared heat dissipation coatings, but at the same time, inorganic film-forming materials are poor. The coating has poor flexibility and poor adhesion to the substrate. The resulting coating is easy to crack and fall off, and the substrate treatment is strictly required.

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  • Inorganic far-infrared nano-coating material and coating process thereof
  • Inorganic far-infrared nano-coating material and coating process thereof
  • Inorganic far-infrared nano-coating material and coating process thereof

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Embodiment

[0013] A nanometer inorganic far-infrared coating and its coating process, calculated according to the weight percentage, including the following raw materials: the primer is made of epoxy resin: 20%-25%, amino resin: 4%- 5%, solvent: 20%-35%, anti-settling powder: 1%-1.5%, flake reinforcing filler: 10%-15%, pigment: 20%-25%, dispersant: 0.5%-1%, flow Leveling agent: 0.5%-1%, the topcoat is composed of silica sol: 35%-40%; anti-settling powder: 1%-1.5%; far-infrared energy powder: 20%-25%; pigment: 5%-7% ; Flaky reinforcing filler: 10%-15%; Methylsiloxane: 20%-25%.

[0014] The materials of the primer are added in order under the dispersion condition, dispersed evenly, ground to a fineness of less than 15 μm in a horizontal sand mill, filtered through 300 mesh, and repacked; the topcoat silica sol, anti-settling powder, far-infrared Energy powder, pigments and flaky reinforcing fillers are added in sequence under dispersion conditions, and the dispersion is even. Grind with a...

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Abstract

The invention relates to an inorganic far-infrared nano-coating material and a coating process thereof. By weight percent, a primer of the coating material comprises 20-25% of epoxy resin, 4-5% of amino resin, 20-35% of solvents, 1-1.5% of anti-settling powder, 10-15% of lamellar reinforcing filler, 20-25% of pigment, 0.5-1% of dispersant and 0.5-1% of flatting agents, and a finishing coat comprises 35-40% of silica solution, 1-1.5% of anti-settling powder, 20-25% of far-infrared energy powder, 5-7% of pigment, 10-15% of lamellar reinforcing fillers and 20-25% of methylsiloxane. With adding ofthe lamellar reinforcing fillers, the inorganic coating which is high in strength, not easy to crack or come off is produced by forming a flexible film forming matter through siloxane hydrolytic polymerization and nanosilicon dioxide; with combination of the inorganic coating and a base coat having high adhesion force and certain flexibility, the requirement on the adhesion force of a base material in coating construction can be met.

Description

technical field [0001] The invention relates to the field of coatings, in particular to a nanometer inorganic far-infrared coating and a coating process thereof. Background technique [0002] At present, the heat-dissipating coatings on the market are made of organic resins, and the acrylic resins with better infrared heat dissipation effect than other organic resins are selected. They belong to infrared heat dissipation, and the far-infrared effect is poor. The effect is poor, and the organic resin has a wrapping effect on the far-infrared energy powder added in the coating, which further limits the performance of the far-infrared effect. The inorganic film-forming material will not have encapsulation, further improving the far-infrared emission rate, and the far-infrared emission rate reaches 87%. [0003] The natural advantage of inorganic film-forming materials is that the far-infrared effect is better than that of organic film-forming materials. High hardness, weather ...

Claims

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Application Information

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IPC IPC(8): C09D163/00C09D1/00C09D5/00
CPCC09D1/00C09D5/002C09D163/00C08L61/20
Inventor 张义坤张磊和
Owner 安徽友瓷化工科技有限公司