Double-sided superconducting quantum chip
A superconducting quantum and chip technology, which is applied in the direction of semiconductor devices, electrical components, and electric solid devices, can solve the problems of wasting chip area, increasing the number of bits, and difficult algorithm execution, achieving the effect of rational use of space and increased flexibility
Active Publication Date: 2019-03-19
EAST CHINA INST OF COMPUTING TECH
View PDF8 Cites 3 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
This design method enables coupling between any two qubits, but the disadvantage is that continuing to increase the number of bits wastes chip area
The other is to use a linear arrangement, each qubit is only coupled to the adjacent qubits, lined up, and the scalability is better, but the algorithm execution is difficult
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0026] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that for those of ordinary skill in the art, several changes and improvements can be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.
[0027] The substrate material of the quantum chip can be silicon wafer, gemstone wafer or others, and through holes are made on the silicon wafer or sapphire substrate by laser drilling or reactive ion etching technology. The inside of the through hole is filled with metal aluminum or other media by techniques such as electron beam evaporation deposition to make a transmission line that can pass microwave signals. In the A side and B side of the chip substrate of the present invention, th...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a superconducting quantum chip. Quantum bit units and microwave signal control wires are laid on the front side of a substrate, and microwave signal reading wires are laid on the back side of the substrate. A data transmission quantum bit is adopted as a medium, five or four quantum bits form a group, and information interaction with other quantum bit groups on a layout is carried out. A laser drilling or reactive ion etching method is adopted, through holes are fired on the substrate, the through holes are filled with microwave signal transmission media, and quantum signal transmission on the front side and the back side can be ensured. The scheme solves the shortcoming of insufficient quantum bit integration degree through one-side wiring and can obviously improvethe bit integration number of the superconducting quantum chip.
Description
Technical field [0001] The present invention relates to the field of superconducting quantum chips, in particular, to a superconducting quantum chip, in particular to the wiring design of an integrated quantum computing chip based on a through-hole structure. Background technique [0002] With the rapid growth of modern technology's demand for computing power, quantum computing has gradually entered the public eye. The realization of quantum computing must go through the preparation process of large-scale qubits. For example, superconducting qubits, ion traps, spintronics, and photons. These different types of qubits have their own advantages and disadvantages. Superconducting qubits have significant advantages in terms of scalability, mainly because the preparation process of superconducting qubits is compatible with traditional semiconductor processes. [0003] At present, superconducting quantum chips have selected a single-sided layout. For example, IBMQ cloud quantum comput...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L27/02
CPCH01L27/0207
Inventor 余玄李永超倪明周明孙国柱
Owner EAST CHINA INST OF COMPUTING TECH