Polyamide acid, polyamide acid solution, polyimide, polyimide film, laminate, flexible device, and method of manufacturing polyimide film

A technology of polyimide film and polyamic acid, which is applied in the field of polyamic acid solution, polyimide film, polyimide, and polyamic acid, can solve problems such as component damage and substrate warping, and achieve Excellent thermal dimensional stability and transparency

Active Publication Date: 2019-04-16
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of forming electronic components mainly composed of inorganic materials on a plastic film substrate, the difference in thermal expansion coefficient between the inorganic material and the plastic film substrate may cause stress at the component formation interface, warpage of the substrate, or destruction of the component.

Method used

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  • Polyamide acid, polyamide acid solution, polyimide, polyimide film, laminate, flexible device, and method of manufacturing polyimide film
  • Polyamide acid, polyamide acid solution, polyimide, polyimide film, laminate, flexible device, and method of manufacturing polyimide film

Examples

Experimental program
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preparation example Construction

[0039] The preparation method of the polyamic acid solution containing imidazoles is not particularly limited. Imidazoles may be added to a polyamic acid solution obtained by polymerization of tetracarboxylic dianhydride and diamine in an organic solvent, or imidazoles may be added to a solution before or during the polymerization reaction. When imidazoles are contained in a reaction system, tetracarboxylic dianhydride ring-opens and the reactivity with diamine may fall. Therefore, the method of adding imidazoles to the polyamic-acid solution obtained by superposition|polymerization of tetracarboxylic dianhydride and diamine is preferable from a viewpoint of controlling the molecular weight of polyamic acid. The imidazoles may be directly added to the polyamic acid, or the imidazoles previously mixed with a solvent may be added to the polyamic acid.

[0040] Various organic or inorganic low-molecular or high-molecular compounds may be compounded in order to impart processabil...

Embodiment 1

[0070] Add 400.00 g of N-methyl-2-pyrrolidone (hereinafter referred to as NMP) and 50.47 g of TFMB to a 2 L separable glass flask equipped with a stirrer equipped with a stainless steel stirring rod and a nitrogen gas introduction tube, and stir And after making it melt|dissolve, CHDA2.00g was added, it stirred, and it melt|dissolved. Stirring the solution, 36.07 g of BPDA and 11.46 g of PMDA were added sequentially, and it stirred for 24 hours, and obtained the polyamic-acid solution. The addition concentration of the diamine component and the tetracarboxylic dianhydride component in this reaction solution was 20.0 weight% with respect to the reaction solution whole quantity.

Embodiment 2

[0072] To 500 g of a 20.0% by weight polyamic acid solution synthesized in the same manner as in Example 1, 1 g of 1,2-dimethylimidazole (hereinafter sometimes referred to as DMI) (1 weight part per 100 parts by weight of polyamic acid) was added. part, 0.03 mol with respect to 1 mol of the amide group of a polyamic acid), and the polyamic-acid solution was prepared.

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Abstract

The polyamide acid according to the present invention contains 2,2-bistrifluoromethyl benzidine and trans-1,4-cyclohexane diamine as diamine components, and pyromellitic anhydride and 3,3,4,4-biphenyltetracarboxylic dianhydride as tetracarboxylic dianhydride components. The proportion of trans-1,4-cyclohexane diamine to the total diamine content is preferably 0.5 to 40 mol%. The polyimide is obtained through dehydration ring closure of the polyamide acid.

Description

technical field [0001] The present invention relates to polyamic acid, polyamic acid solution, polyimide, and polyimide film. Furthermore, this invention relates to the laminated body and flexible device provided with the polyimide film. Background technique [0002] Electronic devices such as displays, solar cells, and touch panels are required to be thinner, lighter, and more flexible, and studies are underway to use plastic film substrates instead of glass substrates. [0003] In the manufacturing process of these electronic devices, electronic components such as thin film transistors and transparent electrodes are arranged on a substrate. Since the formation of electronic components requires a high-temperature process, the plastic film substrate is required to have heat resistance that can adapt to the high-temperature process. When forming electronic components mainly composed of inorganic materials on a plastic film substrate, the difference in thermal expansion coef...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10B29C41/12B32B27/34C08J5/18C08L79/08B29K79/00B29L7/00
CPCB29C41/12C08J5/18C08L79/08B29K2079/08C08G69/265C08G69/42C08G73/1039C08G73/1042C08J2379/08B32B27/281Y10T428/31721B32B2307/412B32B2457/20
Inventor 宇野真理
Owner KANEKA CORP
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