Circuit board and electric connector with same

A technology of circuit boards and paths, applied in the direction of circuits, connections, fixed connections, etc., can solve the problems that affect the signal integrity of high-speed systems, and the differential routing structure cannot effectively reduce the crosstalk noise of adjacent differential pairs, so as to reduce signal crosstalk, Enhance the effect of coupling

Pending Publication Date: 2019-04-26
OUPIN ELECTRONICS KUNSHAN
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the actual circuit board (PCB) layout, the traditional differential routing structure cannot effectively reduce

Method used

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  • Circuit board and electric connector with same
  • Circuit board and electric connector with same
  • Circuit board and electric connector with same

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[0048] The following embodiments are described with reference to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as "up", "down", "front", "rear", "left", "right", "top", "bottom", etc., are only for reference to the attached drawings. direction. Therefore, the directional terms used are for describing and understanding the present invention, not for limiting the present invention.

[0049] Please refer to figure 1 , figure 2 As shown, the circuit board 10 of the present invention is sequentially stacked from top to bottom with a first circuit layer 101, a first insulating layer 102, a second circuit layer 103, an insulating substrate 104, a third circuit layer 105, a first circuit layer 105, and a Two insulating layers 106 and a fourth circuit layer 107 . At least one first metal trace 201 is formed on the first circuit layer 101, at least one second metal...

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Abstract

The invention discloses a circuit board and an electric connector with the same. The circuit board is provided with a first circuit layer, a first insulating layer, a second circuit layer, an insulating substrate, a third circuit layer, a second insulating layer and a fourth circuit layer sequentially from top to bottom in a stacked mode. A first metal route and a second metal route are formed onthe first circuit layer and the second circuit layer correspondingly, and a first differential route pair is constituted. A third metal route and a fourth metal route are formed on the third circuit layer and the fourth circuit layer correspondingly, and a second differential route pair is constituted; and the two metal routes constituting each differential route pair correspond in the up-down direction and are different in width, and thus crosstalk between signals of the adjacent differential pairs can be lowered.

Description

technical field [0001] The invention relates to the technical field of connectors, in particular to a circuit board capable of transmitting differential signals and an electrical connector with the circuit board. Background technique [0002] Differential Signal (Differential Signal) is a signal transmission technology, which is more and more widely used in high-speed circuit design. The most critical signal in the circuit often adopts a differential structure design, and the pair carrying the differential signal The lines are called differential traces. [0003] In the actual circuit board (PCB) layout, the traditional differential routing structure cannot effectively reduce the crosstalk noise between adjacent differential pairs, which will affect the signal integrity of the high-speed system. [0004] Therefore, it is necessary to provide a new circuit board, which adopts a new wiring method to solve the problems existing in the prior art. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): H05K1/02H01R12/58
CPCH01R12/585H05K1/0228H05K1/0245
Inventor 陈信智
Owner OUPIN ELECTRONICS KUNSHAN
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