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Core material and method of forming solder joints and bump electrodes

A technology of core material and solder, applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve problems such as short circuit between electrodes and contact with each other

Active Publication Date: 2020-02-28
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If such a situation occurs, there is a possibility that the solder is extruded from the electrodes, the electrodes come into contact with each other, and a short circuit between the electrodes may occur.

Method used

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  • Core material and method of forming solder joints and bump electrodes
  • Core material and method of forming solder joints and bump electrodes
  • Core material and method of forming solder joints and bump electrodes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Preferred embodiments of the present invention will be described in detail below. In the present invention, there are provided a core material in which a Sn-based solder alloy containing Sn and Sb is plated and coated on a core surface, and a solder joint using the same, wherein, The distribution of Sb in the solder plating layer was uniform.

[0058] The composition of the solder plating layer of the present invention contains a (Sn—Sb)-based alloy containing Sn and Sb. Regarding the content of Sb, if the amount of Sb relative to the entire alloy is in the range of 0.1 to 30.0% by mass, the concentration ratio of Sb can be controlled within the specified range of 70.0 to 125.0%, and the solder plating layer can be made Sb is evenly distributed.

[0059] For example, in the case of a (Sn-5Sb) based solder alloy, the distribution of Sb to be the target value is 5% by mass as the target value, and the allowable range is 3.59% by mass (concentration ratio: 71.8%) to 5.94...

Embodiment 2

[0122]In Example 2, the same measurement was performed for the case of forming the solder plating layer 16 of a quaternary Sn-based solder alloy containing Ag, Cu, and Sb (Sn-4Ag-1Cu-10Sb). . Regarding the distribution of Sb at this time, the target value is 10% by mass, and the allowable range is 7.91% by mass (concentration ratio: 79.1%) to 12.01% by mass (concentration ratio: 120.1%).

[0123] The manufacturing method of Cu core ball is the same as embodiment 1.

[0124] The specifications and experimental conditions, such as the diameters of the Cu balls and Cu core balls used, the film thicknesses of the Ni base plating layer and the solder plating layer, are the same as in Example 1 except for the composition of the solder plating layer. conditions of.

[0125] The results are shown as Table 2 samples E to H. At this time, since the target value of Sb is 10% by mass, as shown in samples E to H, it is 7.91 to 12.01% by mass (the average value obtained by measuring 10 t...

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Abstract

Core material and method of forming solder joints and bump electrodes. Provide a core material in which the Sb in the solder plating layer is uniform and the Sb concentration ratio is within a predetermined range. The core material is coated with a (Sn-Sb) solder alloy containing Sn and Sb on the surface of the core (12). In the solder plating layer, Sb is distributed in the solder plating layer in a predetermined range of a concentration ratio of 70.0 to 125.0%. Since the Sb in the solder plating layer is uniform, the Sb concentration ratio is within a predetermined range over the entire area including the inner peripheral side and the outer peripheral side of the solder plating layer. Therefore, there is no possibility that the inner peripheral side melts earlier than the outer peripheral side, and a difference in volume expansion occurs between the inner peripheral side and the outer peripheral side, thereby preventing the core material from being thrown off. Since the entire solder plating layer is melted almost uniformly, there is no misalignment of the core material due to variation in melting timing, and there is no fear of short circuit between electrodes due to misalignment or the like.

Description

technical field [0001] The present invention relates to a core material, a solder joint having a solder bump using the core material, and a method for forming a bump electrode. Background technique [0002] In recent years, with the development of small information equipment, the electronic components mounted therein are being rapidly reduced in size. In electronic components, ball grid arrays (BGAs) in which electrodes are arranged on the back surface are used in order to cope with the reduction in the size of connection terminals and the reduction in mounting area due to the demand for miniaturization. [0003] Electronic components to which BGAs are applied include, for example, semiconductor packages. A semiconductor package is formed by sealing a semiconductor chip having electrodes with a resin. Solder bumps are formed on electrodes of the semiconductor chip. A solder bump is formed by bonding a solder ball to an electrode of a semiconductor chip. A semiconductor p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26H01L21/60C22C13/02C25D3/56
CPCH01L24/11H01L24/15C22C13/02C25D3/56B23K35/262H01L24/10B23K35/0261H01L2021/60022B22F1/16
Inventor 近藤茂喜土屋政人须藤皓纪川崎浩由六本木贵弘相马大辅佐藤勇
Owner SENJU METAL IND CO LTD