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Heat dissipation material used for producing LED lamp shells

A technology of LED lamp shell and heat-dissipating material, applied in polyether coatings, coatings, adhesive additives, etc., can solve the problems affecting the service life and operation stability of lamps, heat generation, etc., and achieve extended service life and working stability. , Improve the adsorption capacity, the effect of efficient transfer

Active Publication Date: 2019-05-07
重庆秉为科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, LED lamps will also generate heat during the lighting process. If the temperature of the lamp is too high, it will affect the service life of the lamp and the stability of operation.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment 1 of the present invention: a heat dissipation material for producing LED lamp housings, characterized in that the adhesive layer consists of the following components in parts by weight: 27 parts of polyethylene isophthalate, polyethylene terephthalate 11 parts of butylene glycol diformate, 31 parts of epoxy resin, 11 parts of graphene powder, 9 parts of methacryloxysilane; the heat dissipation layer is composed of the following components by weight: 15 parts of ceramic powder, polyethylene glycol 5 parts of alcohol, 7 parts of graphene powder, 9 parts of epoxy resin, 9 parts of polyimide, 3 parts of triethoxychlorosilane, 11 parts of polyethylene glycol, 1 part of magnesium isooctanoate, 2 parts of zinc borate, 1 part of vanadium diboride, 2 parts of sodium borohydride, 0.1 part of sodium zeolite powder, and 0.1 part of medical stone powder. The particle size of the sodium zeolite powder is less than or equal to 35 microns, the particle size of the medical s...

Embodiment 2

[0017] Embodiment 2: a kind of heat dissipation material for producing LED lamp shell, it is characterized in that, adhesive layer is made up of following components by weight: polyethylene isophthalate 36 parts, polybutylene terephthalate 17 parts of glycol ester, 37 parts of epoxy resin, 17 parts of graphene powder, 13 parts of methacryloxysilane; by weight, it is composed of the following components: 17 parts of ceramic powder, 12 parts of polyethylene glycol, graphite 13 parts of vinyl powder, 13 parts of epoxy resin, 14 parts of polyimide, 7 parts of triethoxychlorosilane, 17 parts of polyethylene glycol, 3 parts of magnesium isooctanoate, 4 parts of zinc borate, 3 parts of vanadium diboride parts, 5 parts of sodium borohydride, 0.3 parts of sodium zeolite powder, and 0.4 parts of medical stone powder.

[0018] The particle size of the sodium zeolite powder is less than or equal to 35 microns, the particle size of the medical stone powder is less than or equal to 25 micro...

Embodiment 3

[0021] Embodiment 3: A heat dissipation material for producing LED lamp housings, characterized in that the adhesive layer is composed of the following components in parts by weight: 31 parts of polyethylene isophthalate, polybutylene terephthalate 13 parts of glycol ester, 35 parts of epoxy resin, 14 parts of graphene powder, 11 parts of methacryloxysilane; by weight, it consists of the following components: 16 parts of ceramic powder, 8 parts of polyethylene glycol, graphite 11 parts of vinyl powder, 11 parts of epoxy resin, 13 parts of polyimide, 5 parts of triethoxychlorosilane, 14 parts of polyethylene glycol, 2 parts of magnesium isooctanoate, 3 parts of zinc borate, 2 parts of vanadium diboride parts, 4 parts of sodium borohydride, 0.2 parts of sodium zeolite powder, and 0.3 parts of medical stone powder.

[0022] The particle size of the sodium zeolite powder is less than or equal to 35 microns, the particle size of the medical stone powder is less than or equal to 25 ...

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Abstract

The invention discloses a heat dissipation material used for producing LED lamp shells. The heat dissipation material comprises a heat dissipation layer and an adhesive layer. The adhesive layer is composed of, by weight, 27-36 parts of polyethylene glycol isophthalate, 11-17 parts of polybutylene terephthalate, 31-37 parts of epoxy resin, 11-17 parts of graphene powder, and 9-13 parts of methacryloxy silane. The heat dissipation layer is composed of, by weight, 15-17 parts of ceramic powder, 5-12 parts of polyethylene glycol, 7-13 parts of graphene powder, 9-13 parts of epoxy resin, 9-14 parts of polyimide, 3-7 parts of triethoxy chlorosilane, 11-17 parts of polyethylene glycol, 1-3 parts of magnesium isooctanoate, 2-4 parts of zinc borate, 1-3 parts of vanadium diboride, 2-5 parts of sodium borohydride, 0.1-0.3 part of natrolite, and 0.1-0.4 part of medical stone powder. By means of the heat dissipation material, the heat dissipation capacity of LED lamps under the working conditioncan be improved, thus the service life of the LED lamps is prolonged, and the working stability of the LED lamps is improved. In addition, the heat dissipation material is provided with the adhesive layer, the function of improving adsorption capacity of the heat dissipation layer is achieved, and heat can be transferred efficiently.

Description

technical field [0001] The invention relates to LED lamps, in particular to a heat dissipation material for producing LED lamp shells. Background technique [0002] LED lighting fixtures are the general term for LED lighting fixtures, which refer to appliances that can transmit light, distribute and change the light distribution of LED light sources, including all parts and components required to fix and protect LED light sources except for LED light sources, as well as connections to power sources Required wiring accessories. With the further maturity of LED technology, LED will achieve more and better development in the field of design and development of living room lighting fixtures. However, LED lamps also generate heat during the lighting process. If the temperature of the lamp is too high, it will affect the service life and operation stability of the lamp. Based on the above problems, improving the heat dissipation capability of LED lamps under working conditions ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V3/10C09J4/06C09J11/04C09D171/02C09D7/61C09D7/63C09D7/65
Inventor 王俊
Owner 重庆秉为科技有限公司
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