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Chip scale package LED light source and manufacturing method thereof

A chip-level packaging, LED light source technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of easy-to-break CSPLED chips, easy colloid fall off, weak mechanical strength of CSPLED, etc., to improve the anti-vulcanization ability and mechanical strength. , the effect of improving the anti-stress ability

Inactive Publication Date: 2019-05-07
WUHU JUFEI PHOTOELECTRIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] A chip-level packaged LED light source provided by the present invention and its manufacturing method mainly solve the technical problem of solving the weak mechanical strength of the CSP LED in the existing structure, which leads to easy breakage during the application process and the easy fall off of the colloid around the CSP LED chip The problem

Method used

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  • Chip scale package LED light source and manufacturing method thereof
  • Chip scale package LED light source and manufacturing method thereof
  • Chip scale package LED light source and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0042] see image 3 As shown, the chip-scale package LED31 is fixed on the circuit board 32. Since the chip-scale package LED31 has no substrate, its mechanical strength is low. , the chip-scale package LED31 is easy to break and produce lack of brightness; meanwhile, the fluorescent glue or white wall glue around the chip in the chip-scale package LED31 is also easy to detach after high and low temperature cycles, resulting in a great change in the luminous color.

[0043] In order to solve the above problems, this embodiment provides a new chip-scale package LED light source. The chip-scale package LED light source provided by this embodiment can be used in various fields such as illumination, indication and backlight. see Figure 4 As shown, the chip-scale package LED light source provided in this embodiment includes a circuit board 42, a chip-scale package LED 41 fixed on the circuit board, and a protective adhesive layer 43 formed on the circuit board and covering the ch...

Embodiment 2

[0056] In order to better understand the present invention, this embodiment further describes the present invention by taking a manufacturing method of the chip-scale package LED light source shown in Embodiment 1 as an example.

[0057] See Figure 8 As shown, the chip-scale package LED light source manufacturing method provided in this embodiment includes:

[0058] S801: Fixing the chip scale package LED on the circuit board.

[0059] In this embodiment, the way of fixing the chip-scale package LED on the circuit board for electrical connection can be various ways to realize the electrical connection between the chip-scale package LED and the circuit board, for example including but not limited to welding, conductive bonding and so on.

[0060] In this embodiment, the number of chip-scale packaged LEDs fixed on the circuit board can be flexibly set according to specific application scenarios, and only one LED can be fixed, or multiple LEDs can be fixed.

[0061] In this em...

Embodiment 3

[0079] In order to better understand the present invention, this embodiment takes the chip-scale packaged LED light source as an example as a backlight light source, and combines a complete production process from preparation to storage to further illustrate the present invention. see Figure 11 As shown, the production process includes:

[0080] S1101: Fix the circuit board (eg PCB board) on the carrier.

[0081] S1102: Spray codes on the circuit board, this step can be omitted, and the specific content of the codes can be sprayed with the manufacturer's name, product name, performance parameters, logos, etc.

[0082] S1103: Print solder paste on the corresponding pads on the circuit board, and the specific printing method can be flexibly selected.

[0083] S1104: To perform solder paste printing inspection, SPI (Solder Paste Inspection) can be used for inspection, so as to detect whether the solder paste printing is offset, the height deviation of the solder paste printing...

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Abstract

The invention provides a chip scale package LED light source and a manufacturing method thereof. During the manufacturing of the chip scale package LED light source, after chip scale package LEDs arefixed onto a circuit board, a protective adhesive layer covering the chip scale package LEDs is formed on the circuit board, and the areas, opposite to the light-out surfaces of the chip scale packageLEDs, of the protective adhesive layer are transparent adhesive layers. Thus, the protective adhesive layer on the circuit board wraps the chip scale package LEDs, the mechanical strength of the chipscale package LEDs is enhanced by the outer protective adhesive layer, the stress resistance is enhanced, and the situation in which some LEDs fail due to breakage under stress caused by external force or temperature difference is avoided. Meanwhile, the protective adhesive layer wrapping the chip scale package LEDs can also avoid the fluorescence call around the chip or the come-off of white glue after multiples cycles of high and low temperatures and ensure the consistency of the light color. The protective adhesive layer can prevent outside sulfur element from entering the light source toa certain extent, so as to improve the vulcanization resistance of the chip scale package LED light source.

Description

technical field [0001] The present invention relates to the field of LED (Light Emitting Diode, light emitting diode), in particular to a chip-level packaged LED light source and a manufacturing method thereof. Background technique [0002] With the application and development of LEDs, the size requirements of LEDs are getting smaller and smaller. In order to meet the requirements of reducing the size of LEDs, chip-scale package CSP (Chip Scale Package) LEDs appeared. The current CSP LEDs mainly have two structures: [0003] One is five-side emitting CSP LED, see figure 1 As shown, the structural principle is that after the fluorescent adhesive layer 12 is molded on the flip-chip LED chip 11 (FlipLED chip), the finished product is cut to obtain a single CSP LED. The four sides and the front of the top are light-emitting surfaces, and the bottom The back side is provided with positive and negative electrodes 111 . The other is a single-side emitting CSP LED, see figure 2...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/54H01L33/56
Inventor 金中华刘松邢其彬
Owner WUHU JUFEI PHOTOELECTRIC TECH CO LTD
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