Refrigerant closed circulating flash atomizing cooling heat exchange enhancing composite structure surface

Abstract

The invention discloses a refrigerant closed circulating flash atomizing cooling heat exchange enhancing composite structure surface. The surface comprises a substrate and a micro-fin group unit, wherein at least one micro-fin group unit is arranged on the substrate, the micro-fin group unit is composed of four tetrahedron-shaped micro-fins which are completely identical in geometrical parameter,the surface of each micro-fin is plated with a transition layer, a porous coating is arranged on the outer surface of each transition layer, the substrate and the micro-fins are made of the same kindof metal material or non-metal material, and the transition layers and the porous coatings are made of a metal material and a porous foam metal material respectively. According to the surface, the plurality of micro-fin group units composed of four tetrahedron-shaped micro-fins are arranged on the substrate to form the refrigerant closed circulating flash atomizing cooling heat exchange enhancingcomposite structure surface, and the surface is used as the heat exchange enhancing structure surface in the technical fields of high-power CPU chips, LEDs, laser weapons, radars and the like, and hasthe advantages that the space utilization rate is high, a phase-change cooling liquid is saved, the size is small, and the heat exchange efficiency is high.

Description

Technical field [0001] The invention belongs to the technical field of heat exchange, and in particular relates to a composite structure surface with a closed circulation flash spray cooling of a refrigerant to enhance heat exchange. Background technique [0002] With the rapid development of high-tech and integrated circuit technologies such as the Internet, artificial intelligence and big data, the power density of electronic chips such as CPU and GPU is increasing. It is predicted that by 2020, the power density of processor chips will reach 300W / cm 2 . As the temperature rises due to heat accumulation during the working process, the performance and life of the chip will be greatly reduced. Similarly, in the field of high-power LED chip applications, the degree of chip density continues to increase and the power density continues to increase. Since the luminous efficiency is only 20-30%, about 70-80% of the power consumption is converted into low-quality heat energy. Poor he...

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Problems solved by technology

[0006] The object of the present invention is to provide a tetrahedron-shaped cooling-enhanced heat-exchange composite structure surface suitable for refrigerant closed cycle flash spraying, to solve the problem of heat dissipation due to the continuous increase in chip integration and power in the technical fields of semiconductors, LEDs, and radars. Insufficient capacity, low space utilization, weak liquid micro-convection at the bottom, uneven heat dissipation of the base, etc.

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