Preparation method of single-sided circuit board and heat-conducting insulating adhesive film

Abstract

The invention discloses a preparation method of a single-sided circuit board and a heat-conducting insulating adhesive film, which comprises the following steps: S1, cutting a circuit pattern on a copper foil; S2, coating a film on the metal substrate; S3, transferring the copper foil circuit pattern prepared in the S1 to the coated metal substrate prepared in the S2; and S4, after the transfer isfinished, carrying out hot baking treatment and finish curing to obtain the single-sided circuit board. According to the invention, the complex production procedures of the copper-clad plate are reduced, and meanwhile, the aluminum plate does not need to be oxidized, so that the environment is protected, the pain point of the industry is solved, and the environment protection of the industry is promoted. The preparation method of a single-sided circuit board and a heat-conducting insulating adhesive film avoids corrosion in an etching liquid, does not need chemical etching to form a circuit,is a pure physical method, has no chemical reagent and environmental pollution, and can recycle and reuse the copper foil after laser cutting, which saves the production cost, provides a healthy working environment for workers, and simultaneously provides a new production method for green development of the industry.

Description

technical field [0001] The invention relates to the field of circuit board preparation, in particular to a method for preparing a single-sided circuit board and a heat-conducting and insulating adhesive film. Background technique [0002] The layout of the printed circuit board needs to use copper foil to describe the circuit, so copper foil is widely used in the field of printed circuit board applications, but the current mainstream is still the subtraction method, in which copper foil is used and the excess is removed by etching to form a circuit board Existing fabrication techniques on the circuit: [0003] method one: [0004] Step 1: Production of CCL [0005] 1. Apply a layer of thermally conductive and insulating adhesive film on the oxidized metal substrate [0006] (Oxygen treatment: the main function is to form a protective film on the aluminum surface, passivate the aluminum surface, and increase the pressing force) [0007] 2. Apply a layer of copper foil on ...

AI Technical Summary

Problems solved by technology

[0019] In the prior art, the manufacturing process for LED thick-line-width circuit boards uses the subtractive method to etch circuits on aluminum-based copper-clad laminates. There are dozens of processes in the production process of thick-line-width circuit boards prepared by the subtractive method. There are chemical substances in the process, copper, organic matter, ammonia nitrogen, acid, alkali, etc. will enter the wastewater. This method consumes a lot of energy and water, and there are technical problems such as complicated process and serious environmental pollution.