A low-dielectric-constant poly(arylene ether nitrile) foam material having a double-peak foam structure, and a preparing method and use thereof

A technology of polyarylether nitrile and foam materials, which is applied in the field of special engineering plastics, can solve the problems of restricting the development of special engineering plastic foams, achieve good mechanical properties, passivate crack diffusion, and broaden the application range

Active Publication Date: 2019-05-21
INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, special engineering plastics often have relatively high processing temperatures (>300°C), while the decomposition temperature of existing high-temperature chemical foaming agents is only about 200°C. Therefore, this also limits the development of special engineering plastic foams to a certain extent.

Method used

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  • A low-dielectric-constant poly(arylene ether nitrile) foam material having a double-peak foam structure, and a preparing method and use thereof
  • A low-dielectric-constant poly(arylene ether nitrile) foam material having a double-peak foam structure, and a preparing method and use thereof
  • A low-dielectric-constant poly(arylene ether nitrile) foam material having a double-peak foam structure, and a preparing method and use thereof

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Experimental program
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preparation example Construction

[0030] In any embodiment, the preparation method of the low-dielectric polyarylether nitrile foam material with bimodal cell structure of the present invention, the schematic diagram is as follows figure 1 As shown, it specifically includes the following steps:

[0031] 1) Preparation of samples to be foamed

[0032] Using N-methylpyrrolidone as solvent, a certain amount of nano-SiO 2 Add to the solvent and ultrasonically disperse for 30 minutes; in addition, use N-methylpyrrolidone as the solvent, add a certain amount of PEN powder into the solvent and stir at 200°C for 30 minutes to fully dissolve the PEN; then mix the above two solutions, stir and sonicate 30min; then pour the solution on the surface of a clean glass plate and cast it into a film; put the glass plate in an oven and dry it at 180°C for 12 hours to remove the solvent, and after the glass plate is naturally cooled to room temperature, immerse it in a water tank, and the film will fall off automatically ; Aft...

Embodiment 1

[0037] PEN resin and nano SiO 2 The matching ratio is as follows:

[0038] Raw material name

Embodiment 2

[0040] PEN resin and nano-SiO 2 The matching ratio is as follows:

[0041] Raw material name

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PUM

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Abstract

A low-dielectric-constant PEN foam material having a double-peak foam structure, and a preparing method and use thereof are disclosed. The PEN foam material having a double-peak foam structure is prepared by adopting nanometer SiO2 as a heterogeneous nucleation agent through a batch supercritical fluid foaming manner by utilizing PEN bulk homogeneous nucleation and nanometer SiO2 particle heterogeneous nucleation. Large foam pores allow the material to achieve effective weight reduction, and greatly reduce the dielectric constant of the material, and small pores can effectively passivated crack diffusion of the material in a stressed cracking process and absorb more energy, thus providing good mechanical performance. In addition, the material has instructional significance for developmentof special engineering plastic foam materials and use of the material in the field of electronic material is further expanded.

Description

technical field [0001] The invention relates to the technical field of special engineering plastics, in particular to a low-dielectric polyarylether nitrile foam material with bimodal cell structure and a preparation method thereof. Background technique [0002] Low-dielectric materials are widely used in the field of electronics, and the research on these materials is closely related to polymer materials. The introduction of cells inside the material is an effective way to reduce its dielectric constant, but too large a cell size can easily lead to insufficient material strength, and too small a cell size and too low a cell density are not enough to meet the requirements of low dielectric constant. In contrast, the polymer microfoam material with bimodal cell structure can effectively reduce the weight of the material and greatly reduce the dielectric constant of the material because of the large cells, and the small cells can provide better physical properties. and arouse...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/12C08L71/10C08K3/36
Inventor 雷雅杰祁青贺江平王宪忠张风顺刘涛戴西洋余雪江孙素明
Owner INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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