Encapsulation structure and electronic device

Abstract

An embodiment of the invention discloses an encapsulation structure comprising a substrate, a bare chip and a heat dissipation cover, wherein the bare chip is mounted on the surface of the substrate,the heat dissipation cover is connected to the substrate and covers the periphery of the bare chip, the heat dissipation cover comprises a fixing portion and a heat conduction portion, the fixing portion is fixedly connected to the substrate, the heat conduction portion directly faces the surface, facing away from the substrate, of the bare chip, a heat conduction adhesive is provided between thebare chip and the heat conduction portion, and a slot is provided between the heat conduction portion and the fixing portion to reduce the rigidity of the heat dissipation cover. The embodiment of theinvention further discloses an electronic device. The encapsulation structure and electronic device can reduce the risk of the heat conduction adhesive being delaminated and increase the reliabilityof the encapsulation structure.

Description

technical field [0001] The invention relates to packaging technology, in particular to an electronic device using a packaging structure including a heat dissipation cover. Background technique [0002] With the improvement of chip integration channel rate, system application requires further improvement of integration level, and the number of chip high-speed signal channels has increased significantly, resulting in continuous increase of chip power consumption; in order to ensure the realization of link drive capability, signal isolation and system interconnection, packaging The size is also gradually increased. However, the ensuing package heat problem and stress problem are more severe than small-size low-power chip packages; in addition, the gradual popularization of 2.5D / 3D packages also puts forward higher requirements for package size and package heat dissipation. At present, the common packaging form adopts the structure that the back of the die is connected to the h...

AI Technical Summary

Problems solved by technology

However, due to the thermal expansion (CTE) mismatch between the various packaging materials, the thermal stress during the operation of the die will cause the package to warp and deform, resulting in relative displacement between the die and the heat sink cover, which in turn will cause delamination of the thermal conductive adhesive

The delamination of the thermal conductive adhesive will interrupt the heat dissipation channel, and the heat cannot be diffused from the die, resulting in excessive operating temperature of the die, deterioration of the electrical performance of the die, accelerated die aging, and even damage to the die

Secondly, although the high rigidity of the heat dissipation cover limits the warping deformation of the package, it also increases the risk of board-level solder ball fracture

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