78results about How to "Reduce the risk of delamination" patented technology

Broadly speaking, the invention pertains to substrates for use in semiconductor manufacturing. A peripheral ledge or similar structure can be provided in a die attach pad, so as to retain adhesive that may flow from the die support surface when the die is attached to the die attach pad. In this manner, adhesive is prevented from flowing off the die attach pad, where it can create unwanted conductive areas on the outer surface of an IC package. The accompanying reduction in area of the die support surface, and retention of adhesive from any downbond areas, also prevents delamination of the adhesive.

The invention relates to the field of a steel plastic tube, in particular to a plastic-lined steel plastic composite tube and a manufacturing method thereof. The plastic-lined steel plastic composite tube comprises a plastic lining tube and a steel intermediate tube, wherein the outer of the steel intermediate tube is coated with outer paint of epoxy or polyester materials. Because of internal plastic lining and external plastic coating, the steel plastic tube makes full use of inlayer corrosion protection and rust protection of the plastic lining and favorable aging, functionalization (e.g. flame retardance and the like) and other properties of the external plastic coating, thereby improving the respective defects caused by single plastic lining and single plastic coating.

The invention discloses a shell assembly and a foldable electronic device. The shell assembly includes: a first shell; a second shell, arranged side by side at an interval with the first shell; a bending part, arranged between the first shell and the second shell and being provided with a first side edge and a second side edge which are arranged back to back, the first side edge facing the first shell and being connected with the first shell, and the second side edge facing the second shell and being connected with the second shell; a first supporting sheet, the first shell being provided witha first mounting surface, and the first supporting sheet being opposite to the first mounting surface and being connected to the first shell in a sliding manner; a second shell, provided with a second mounting surface which is opposite to or opposite to the first mounting surface when the second shell is folded in the first shell, and the second supporting sheet being opposite to the second mounting surface and is connected to the second shell in a sliding manner. The first supporting piece and the second supporting piece slide towards the bent part at the same time or deviate from the bent part at the same time. The layering risk of the flexible screen can be reduced, and the service life of the flexible screen is prolonged.

The invention relates to a preparation method of an external thermal insulation composite material, comprising the following steps: (1) performing a hydrophobic treatment on a hydrophilic first reinforcement to obtain a hydrophobic first reinforcement; (2) connecting the hydrophobic first reinforcement and a hydrophilic second reinforcement to obtain a preform; and (3) impregnating the part of thepreform including at least the second reinforcement with a hydrophilic impregnant used for impregnation, and then drying to obtain the external thermal insulation composite material. The invention also relates to an external thermal insulation composite material prepared by the above preparation method. The an anti-scouring aerogel composite material prepared from the external thermal insulationcomposite material can be used for profile machining to obtain a component of a desired profile, or the overall external profile machining is carried out after assembling of an aircraft, so as to accurately ensure aerodynamic shape of the aircraft.

The invention provides a co-extrusion adhesive film, a solar cell module and double-layer glass. The co-extrusion adhesive film comprises at least two adhesive film layers; raw materials for forming each adhesive film layer comprise a first component and a second component, wherein each first component is 1-100 parts of first matrix resin grafted with an electron withdrawing group, and second components respectively and independently contain 0.01-25 parts of a water producing agent and/or 0.01-2.5 parts of a catalyst, and the second components are not water producing agents or catalysts at thesame time; and the first matrix resin and the water producing agents can undergo cross-linking reactions, and the catalysts can catalyze the cross-linking reactions. When the co-extrusion adhesive film is used as a raw material for preparing the solar cell module, the photoelectric conversion efficiency of the solar cell module can be greatly improved; and cost is low, process is simple, and industrial popularization is convenient.

The invention relates to a blind hole uncapping method using laser. The blind hole uncapping method comprises the steps that grooving laser beams are irradiated to a surface layer conducting layer ofa to-be-uncapped circuit board substrate, laser etching is carried out on the surface layer conducting layer of the to-be-uncapped circuit board substrate according to a preset track, and an annular groove is formed; and heating laser beams are irradiated to the annular groove and a to-be-uncapped surface layer conducting layer area on the inner side of the annular groove, heating is carried out,the surface layer conducting layer of the circuit board substrate on the inner side of the annular groove becomes loose and drops off by heating, the blind hole uncapping is finished, and a primary blind hole is formed. According to the blind hole uncapping method using the laser, the surface layer conducting layer of a circuit board is subjected to closed-loop grooving using the grooving laser beams, the annular groove is obtained, the annular groove and a conducting area in the annular groove are heated using the heating laser beams, under the action of plasma shock waves generated by actionof heating laser light spots and substance in the groove, the surface layer conducting layer of a blind hole to-be-uncapped protecting area becomes loose and drops off, the blind hole uncapping is finished, the primary blind hole is formed, and the blind hole uncapping problem is ingeniously solved.

An embodiment of the invention discloses an encapsulation structure comprising a substrate, a bare chip and a heat dissipation cover, wherein the bare chip is mounted on the surface of the substrate,the heat dissipation cover is connected to the substrate and covers the periphery of the bare chip, the heat dissipation cover comprises a fixing portion and a heat conduction portion, the fixing portion is fixedly connected to the substrate, the heat conduction portion directly faces the surface, facing away from the substrate, of the bare chip, a heat conduction adhesive is provided between thebare chip and the heat conduction portion, and a slot is provided between the heat conduction portion and the fixing portion to reduce the rigidity of the heat dissipation cover. The embodiment of theinvention further discloses an electronic device. The encapsulation structure and electronic device can reduce the risk of the heat conduction adhesive being delaminated and increase the reliabilityof the encapsulation structure.

This invention relates to a plane button package base plate of an IC or a discrete device and its processing method characterizing that base islands and pins are distributed on the front of the base plate in buttons connected by metal thin layers, the base island is the one composed of multiple buttons, the pin is single, the fronts of the islands and the pins have metal layers, the number of the islands is one or many in the package unit of a single IC or discrete device formed in the post package, namely, single unit island or multiple unit base islands composed of multiple buttons, the pins are arrayed at one side, both sides or three sides or surrounding the base islands.

The invention discloses a power type high-current device mounting process. The process adopts a temperature track provided with a temperature rising region, a temperature stabilizing region and a temperature reducing region; the process comprises the following steps: (a) moving a device framework to the temperature rising region, and heating the device framework in the temperature rising region; (b) then moving the device framework to the temperature stabilizing region, and welding solder on a PAD region of the device framework through a spot welding manner; (c) finishing the solder on the PAD region of the device framework into square-structured solder that is matched with a chip size and has a certain height by using a pressing die in the temperature stabilizing region; (d) placing the chip in the PAD region of the device framework in the temperature stabilizing region to enable the metal and the solder on the back surface of the chip to be co-melted in a temperature environment to form alloy so as to obtain a semifinished product; and (e) moving the semifinished product to the temperature reducing region, and enabling the alloy between the chip and the device framework to be cured in the temperature reducing region. According to the power type high-current device mounting process, the processing quality and the reliability level of the product can be improved, the invalidation rate of clients can be reduced, and the service life of the power type high-current device can be improved.

The invention relates to a semiconductor packaging structure and a manufacturing method thereof. The semiconductor packaging structure comprises a baseplate, a junction layer and a chip. A concave part is formed on the baseplate to ensure that the concave part has thicker longitudinal dimension when the junction layer is coated on the baseplate. Therefore, the baseplate has the thicker junction layer when the junction layer is joined with the chip, and the invention provides more stable junction.

The invention relates to a disposable pant-type absorbent article (1) such as a pant diaper, a sanitary pant or incontinence pant, having a longitudinal direction (Y) and a transverse direction (X). Said disposable pant-type absorbent article comprises: a chassis made of laminated web material and having a front section (3) and a back section (4), an absorbent insert (2) located mainly in a crotchportion of the absorbent article (1) and connected to the front and back sections (3, 4) and having an absorbent core (5), wherein a region (31, 23) of the front and/or back section (3, 4) is made ofa laminated elastic web material comprising a plurality of elastic threads extending from a location adjacent a first lateral side of the front and/or back section (3, 4) to a location adjacent an opposite lateral side of the front and/or back section (3, 4). The elastic threads are interrupted in a central area of the absorbent article (1). A first adhesive material (44) primarily for securing sheets of web material of the laminated web material to each other is applied in the region from a location adjacent a first lateral side of the front and/or back section (3, 4) to a location adjacentan opposite lateral side of the front and/or back section (3, 4), while leaving a first gap (55) in the central area of the absorbent article free from the first adhesive (44). A second adhesive material (43) primarily for securing the elastic threads to the sheets of laminated web material is applied in the region from a location adjacent a first lateral side of the front and/or back section (3,4) to a location adjacent an opposite lateral side of the front and/or back section (3, 4), while leaving a second gap (58) in the central area of the absorbent article (1) free from the second adhesive material. A width (56) of the first gap (55) in the direction (X) is smaller than a width (60) of the second gap (58) in the transverse direction (X), such that an adhesive gradient is provided inthe region (31, 32) as seen from a centre of the absorbent article (1) towards the lateral edges of the absorbent article (1).

The invention discloses a photovoltaic tile preparation method and a photovoltaic tile. The photovoltaic tile preparation method comprises the following steps of: laminating: sequentially laying a substrate, a first bonding layer, a first impact-resistant layer, a second bonding layer, a battery layer, a third bonding layer, a second impact-resistant layer, a fourth bonding layer and a front film, and preparing lamination; vacuumizing and dehumidifying; laminating; cooling; cutting; and folding edges. The photovoltaic tile is prepared by the method.

The invention discloses an anticorrosive gas penetration composite packaging material and a preparation method thereof. The composite packaging material is formed by compounding a polyamide polyethylene coextruded film and a biaxially-oriented polyethylene glycol terephthalate film, and the polyamide polyethylene coextruded film is formed by coextruding a heat sealing layer and a corona layer; theheat sealing layer is composed of metallocene polyethylene and low-density polyethylene, and the corona layer is made of a polyamide resin; and an adhesive is applied between the polyamide polyethylene coextruded film and the biaxially-oriented polyethylene glycol terephthalate film in a coating manner. The preparation method comprises the following steps: (1) preparing the polyamide polyethylenecoextruded film; and (2) carrying out intaglio printing on the biaxially-oriented polyethylene glycol terephthalate film, and carrying out dry compounding on the printed biaxially-oriented polyethylene glycol terephthalate film and the polyamide polyethylene coextruded film by using the adhesive. The composite strength, the heat sealing strength and other indexes of the composite packaging material all meet the requirements of product design, and the composite packaging material has good tolerance to corrosive gas, and is suitable for packaging products containing essence and the like.

The invention discloses a PTFE composite glue blocking film for LCP high-temperature lamination, which is characterized in that the PTFE composite glue blocking film sequentially comprises a first release film layer, a first adhesive layer, a high-temperature glue blocking layer, a second adhesive layer and a second release film layer from top to bottom, the first adhesive layer and the second adhesive layer are independently formed by a high-temperature adhesive; and the high-temperature glue blocking layer is a PTFE/PE/hydroxyl-terminated methyl vinyl fluorosilicone oil blended film layer. The invention also provides a production process of the PTFE composite glue blocking film for LCP high-temperature lamination. The PTFE composite glue blocking film for LCP high-temperature laminationdisclosed by the invention is remarkable in release and glue blocking effects, excellent in mechanical property, long in service lifetime and good in high-temperature resistance.

The invention discloses a semiconductor structure and a forming method thereof. The forming method comprises the steps: providing a substrate; forming a first electrode layer on the substrate; forminga dielectric layer on the first electrode layer; forming a second electrode layer on the dielectric layer; forming an oxide layer on the second electrode layer; forming a first etching stop layer onthe surface of the oxide layer; forming an insulating layer on the first etching stop layer; and etching the insulating layer, the first etching stop layer and the oxide layer to form a first contacthole, wherein the bottom of the first contact hole expose the top surface of the second electrode layer, and the first contact hole penetrates through the insulating layer, the first etching stop layer and the oxide layer. According to the invention, the adhesion strength of the second electrode plate and the first etching stop layer is improved, and the risk of layering between the second electrode plate and the first etching stop layer is reduced, so that the packaging quality is improved.

The invention relates to an oxcarbazepine dry suspension, and a preparation method thereof. The oxcarbazepine dry suspension comprises following ingredients, by weight, 30 to 70% of an oxcarbazepine hydroxypropyl-beta-cyclodextrin inclusion compound, 20 to 60% of a filling agent, 1 to 5% of a suspending agent, 0.5 to 5% of a flow aid, 0.3 to 3% of an opacifying agent, and 0.1 to 5% of a flavoring agent; wherein the oxcarbazepine hydroxypropyl-beta-cyclodextrin inclusion compound is prepared via inclusion of oxcarbazepine with hydroxypropyl-beta-cyclodextrin at a weight ratio of 1:1-3. Inclusion of main drug oxcarbazepine with hydroxypropyl-beta-cyclodextrin is capable of increasing the solubility of oxcarbazepine greatly, and increasing bioavailability; and in addition, inclusion of cyclodextrin is capable of covering the bitter taste of oxcarbazepine, and improving compliance of child patients. In preparation process, dry granulation is adopted, and compared with wet granulation, dry granulation possesses following advantages: technical process of dry granulation is stable, and layering risk is reduced.

A carbon fiber composite propeller for a ship comprises a metal hub and four carbon fiber composite blades installed on the metal hub. The metal hub and the carbon fiber composite blades are assembledthrough installation clamping grooves and installation protrusions, and adhesive layers are additionally arranged so that the metal hub and the carbon fiber composite blades are fixedly connected; each carbon fiber composite blade is formed by compositing a prefabricated body and a resin matrix, wherein the prefabricated body is formed by stacking and pasting joint-laying fabrics layer by layer on a mold of the prefabricated body. The prepared carbon fiber composite propeller has the advantages of being high in size precision, high in strength, good in rigidity, light in dead weight, low in noise, resistant to corrosion, resistant to microbial adhesion and the like, and meanwhile has good fatigue performance and impact resistance.