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An amorphous alloy flexible substrate

An amorphous alloy, flexible substrate technology, applied in metal rolling, circuits, electrical solid devices and other directions, can solve the problems of insufficient strength, poor dimensional stability, low glass transition temperature, etc., to achieve bending and bending functions, good Thermoforming ability, simple and easy effect of processing method

Active Publication Date: 2021-07-09
盘星新型合金材料(常州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, there is a problem that flexible substrates cannot have both flexibility and strength. Either they are flexible enough but not strong enough; or they are strong enough but not flexible enough.
Polyimide and other polymers are usually used to prepare flexible substrates. Although polymer substrates have certain flexibility and impact resistance, due to the limited properties of polymers, this material has relatively low dimensional stability under high temperature conditions. Poor and low glass transition temperature
Under high-temperature and low-pressure environments, glass substrates are prone to thermal expansion. If a polymer flexible material is used as a substrate, it is prone to bending and warping of the substrate due to substrate expansion, which affects the appearance and service life of electronic devices. It is obviously disadvantageous

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment example 1

[0044] Implementation Case 1: Zirconium-based Amorphous Alloy Flexible Substrate

[0045] Preparation by vacuum hot pressing method: the alloy composition Zr61Ti11Cu13Ni10Be3Nb2 amorphous alloy raw material is ultrasonically cleaned for 10 minutes, the mold is ground and polished, and then the amorphous alloy raw material and the mold are put into a vacuum hot pressing forming machine. Turn on the vacuum system of the equipment and evacuate until the vacuum degree is greater than 3.0x10 -3 Pa. At the same time, start the heating program of the equipment, and heat the temperature to the range of 310°C-450°C in the supercooled liquid phase region of the Zr61Ti11Cu13Ni10Be3Nb2 amorphous alloy. Start to run the equipment, pressurize the mold, the pressure on the material is 100-1000MPa, and the whole hot-pressing time lasts 60-900s. After the hot pressing process is over, take out the mold sample for rapid cooling, and finally cut the sample, remove the corners, and perform post...

Embodiment example 2

[0047] Implementation Case 2: Zirconium-based Amorphous Alloy Flexible Substrate

[0048] It is prepared by vacuum hot rolling forming method: the Zr61Ti11Cu13Ni10Be3Nb2 amorphous alloy raw material is ultrasonically cleaned for 10 minutes, and then placed on the feeding platform of the vacuum hot rolling mill. Turn on the vacuum system of the equipment and evacuate until the vacuum degree is greater than 3.0x10 -3Pa. At the same time, start the heating program of the equipment, and heat the temperature to the range of 310°C-450°C in the supercooled liquid phase region of the Zr61Ti11Cu13Ni10Be3Nb2 amorphous alloy. Start to run the equipment, carry out hot rolling treatment on the material, and control the feeding speed between 0.01m / s-1m / s. After the hot-rolling process is over, the hot-rolled sample is taken out for rapid cooling, and finally the sample is cut and shaped, and post-processing such as grinding and polishing is performed to make it meet the corresponding surf...

Embodiment example 3

[0050] Implementation Case 3: Titanium-based Amorphous Alloy Flexible Substrate

[0051] It is prepared by vacuum hot-press forming method: the Ti45Zr20Be25Cu10 amorphous alloy raw material is ultrasonically cleaned for 10 minutes, the mold is ground and polished, and then the amorphous alloy raw material and the mold are put into a vacuum hot-press forming machine. Turn on the vacuum system of the equipment and evacuate until the vacuum degree is greater than 3.0x10 -3 Pa. At the same time, start the heating program of the equipment, and heat the temperature to the range of 300°C-410°C in the supercooled liquid phase region of the Ti45Zr20Be25Cu10 amorphous alloy. Start to run the equipment, pressurize the mold, the pressure on the material is 100MPa-1000MPa, and the whole hot pressing time lasts 60s-900s. After the hot pressing process is over, take out the mold sample for rapid cooling, and finally cut the sample, remove the corners, and perform post-processing such as gr...

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PUM

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Abstract

The invention provides an amorphous alloy flexible substrate. The amorphous alloy flexible substrate of the present invention is made of amorphous alloy material; wherein, the amorphous alloy material includes: zirconium-based amorphous alloy, copper-based amorphous alloy, titanium-based amorphous alloy, iron-based amorphous alloy, cobalt One or more of the base amorphous alloys, nickel-based amorphous alloys or rare earth-based amorphous alloys. The flexible substrate of the present invention has the advantages of high elasticity, high strength, good environmental tolerance, and is not easy to undergo plastic deformation.

Description

technical field [0001] The invention relates to the technical field of amorphous alloy application, in particular to an amorphous alloy flexible substrate. Background technique [0002] With the development of semiconductor process technology, research on flexible electronic devices has also made great progress. Flexible electronic devices mainly realize the bendable function of electronic devices by integrating electronic devices on flexible substrates. [0003] As the support and protection component of the entire flexible electronic device, the flexible substrate not only has an important impact on the display quality of the electronic device, but also directly affects the service life of the electronic device. Therefore, the research and development of the flexible substrate has always been attached great importance at home and abroad. [0004] At present, flexible substrates have the problem of not being able to have both flexibility and strength. Either they are flexi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/14B21B1/38B21D22/02B21C37/02
Inventor 范超张晓平王应静彭炜
Owner 盘星新型合金材料(常州)有限公司