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A signal transceiver device and base station

A signal transceiver, radio frequency signal technology, applied in the direction of selection device, antenna support/installation device, wireless communication, etc., can solve the problems of increased card insertion, reduced RRU space utilization, and unfavorable RRU heat dissipation, etc., to improve integration, Improve space utilization and achieve the effect of card heat dissipation

Active Publication Date: 2020-12-04
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of a large array antenna, a large number of connecting components are required, and accordingly, the number of cards increases, thereby reducing the space utilization of the RRU. At the same time, a large number of cards is not conducive to the heat dissipation of the RRU.

Method used

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  • A signal transceiver device and base station
  • A signal transceiver device and base station
  • A signal transceiver device and base station

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] Embodiment 1, the overall introduction of the signal transceiver device;

[0091] see Figure 5 , Figure 5 It is a structural diagram of the signal transceiver device in the embodiment of the present application. As shown in the figure, the signal transceiver device includes at least one plug-in card 10 and a backplane 20. The plug-in card 10 includes two waveguide plates 101 sandwiched between the two waveguide plates 101. Between the multilayer circuit board 102, the antenna array 1011 installed on the second waveguide board 101 and the first waveguide interface 1013, the side of the second waveguide board 101 facing the multilayer circuit board 102 is provided with a waveguide groove, the multilayer circuit board 102 Both sides are provided with a metal layer that matches the waveguide slot, where the matching refers to the cooperation between the metal layer and the waveguide slot to form a double-layer circuit board 102 on both sides and connected to the antenna ...

Embodiment 2

[0098] Embodiment 2, card introduction;

[0099] Optionally, in the above Figure 5 Based on the corresponding example, see again Figure 6 and Figure 7 , it can be seen from the figure that the front-end circuit 1021 is connected to the waveguide channel 1012 through the waveguide conversion section 202 . The waveguide conversion section 202 is a substrate integrated waveguide (SIW), and the specific implementation method is to convert the microstrip into the SIW and then into the waveguide. For an introduction, see Figure 9 as well as Figure 10 , Figure 9 is a schematic diagram of a three-dimensional structure of the waveguide conversion section in the embodiment of the present application, Figure 10 It is a top view of the waveguide conversion section in the embodiment of the present application. As shown in the figure, a printed circuit board (printed circuit board, PCB), low temperature co-fired ceramic (low temperature co-fired ceramic, LTCC) or thin film tech...

Embodiment 3

[0126] Embodiment 3, introduction of waveguide interface;

[0127] Optionally, in the above Figure 5 Based on the corresponding embodiment, the antenna array 1011 specifically includes two antenna sub-arrays, the two antenna sub-arrays are installed between the two waveguide plates 101, and the two antenna sub-arrays correspond to the waveguide channels 1012, and the two antenna sub-arrays One antenna subarray in the array is connected to the waveguide channel 1012 formed between one waveguide plate 101 of the two waveguide plates 101 and the multilayer circuit board 102, and the other antenna subarray in the two antenna subarrays is connected to the second waveguide plate 101. Another waveguide plate 101 is connected to the waveguide channel 1012 formed between the multilayer circuit board 102 .

[0128] Optionally, see Figure 21 , Figure 21 It is a schematic diagram of the dual waveguide structure in the embodiment of the present application. As shown in the figure, th...

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Abstract

The present application discloses a signal transceiver, including: at least one plug-in card and a backplane, the plug-in card includes two waveguide boards, a multi-layer circuit board sandwiched between the two waveguide boards, and an antenna array mounted on the two waveguide boards As well as the first waveguide interface, waveguide grooves are provided on the side of the two waveguide boards facing the multilayer circuit board, and metal layers corresponding to the waveguide grooves are provided on both sides of the multilayer circuit board. A double-layer waveguide channel is formed on both sides of the multilayer circuit board and connected to the antenna array and the first waveguide interface, and the second waveguide interface is provided on the backplane; The butt joint between them realizes the waveguide connection. The application discloses a signal transceiving device and a base station. The present application improves the integration degree of the waveguide structure, improves the space utilization rate of the signal transceiving device, and at the same time facilitates the heat dissipation of the signal transceiving device.

Description

technical field [0001] The present application relates to the technical field of communications, and in particular to a signal transceiving device and a base station. Background technique [0002] In recent years, mobile communication technology has been rapidly developed and widely used. In a fifth-generation (5th-generation, 5G) mobile communication system, a base station includes a baseband unit (baseband unit, BBU), a transceiver unit, and an antenna feeder unit. At present, wireless communication base station products usually use the BBU as a BBU module, and the transceiver unit and the antenna feeder unit as a remote radio unit (RRU) module, in order to achieve lower cost and smaller size And higher conversion efficiency, and support more flexible array configuration, it is very important to choose a suitable RRU physical implementation architecture. [0003] At present, there is a common RRU physical implementation architecture, please refer to figure 1 , figure 1...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04B1/40H04Q1/02H04W88/08H01Q21/00H01Q1/24
CPCH04B1/38H04B1/036H01Q1/246H04W88/085H01Q21/005H01Q1/24H01Q1/526H01Q21/0037H04B1/40H01Q21/00H01Q1/52
Inventor 薛裕胜盛海强齐美清
Owner HUAWEI TECH CO LTD