A signal transceiver device and base station
A signal transceiver, radio frequency signal technology, applied in the direction of selection device, antenna support/installation device, wireless communication, etc., can solve the problems of increased card insertion, reduced RRU space utilization, and unfavorable RRU heat dissipation, etc., to improve integration, Improve space utilization and achieve the effect of card heat dissipation
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Embodiment 1
[0090] Embodiment 1, the overall introduction of the signal transceiver device;
[0091] see Figure 5 , Figure 5 It is a structural diagram of the signal transceiver device in the embodiment of the present application. As shown in the figure, the signal transceiver device includes at least one plug-in card 10 and a backplane 20. The plug-in card 10 includes two waveguide plates 101 sandwiched between the two waveguide plates 101. Between the multilayer circuit board 102, the antenna array 1011 installed on the second waveguide board 101 and the first waveguide interface 1013, the side of the second waveguide board 101 facing the multilayer circuit board 102 is provided with a waveguide groove, the multilayer circuit board 102 Both sides are provided with a metal layer that matches the waveguide slot, where the matching refers to the cooperation between the metal layer and the waveguide slot to form a double-layer circuit board 102 on both sides and connected to the antenna ...
Embodiment 2
[0098] Embodiment 2, card introduction;
[0099] Optionally, in the above Figure 5 Based on the corresponding example, see again Figure 6 and Figure 7 , it can be seen from the figure that the front-end circuit 1021 is connected to the waveguide channel 1012 through the waveguide conversion section 202 . The waveguide conversion section 202 is a substrate integrated waveguide (SIW), and the specific implementation method is to convert the microstrip into the SIW and then into the waveguide. For an introduction, see Figure 9 as well as Figure 10 , Figure 9 is a schematic diagram of a three-dimensional structure of the waveguide conversion section in the embodiment of the present application, Figure 10 It is a top view of the waveguide conversion section in the embodiment of the present application. As shown in the figure, a printed circuit board (printed circuit board, PCB), low temperature co-fired ceramic (low temperature co-fired ceramic, LTCC) or thin film tech...
Embodiment 3
[0126] Embodiment 3, introduction of waveguide interface;
[0127] Optionally, in the above Figure 5 Based on the corresponding embodiment, the antenna array 1011 specifically includes two antenna sub-arrays, the two antenna sub-arrays are installed between the two waveguide plates 101, and the two antenna sub-arrays correspond to the waveguide channels 1012, and the two antenna sub-arrays One antenna subarray in the array is connected to the waveguide channel 1012 formed between one waveguide plate 101 of the two waveguide plates 101 and the multilayer circuit board 102, and the other antenna subarray in the two antenna subarrays is connected to the second waveguide plate 101. Another waveguide plate 101 is connected to the waveguide channel 1012 formed between the multilayer circuit board 102 .
[0128] Optionally, see Figure 21 , Figure 21 It is a schematic diagram of the dual waveguide structure in the embodiment of the present application. As shown in the figure, th...
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