PCB hole composite machining method

Abstract

The invention relates to a PCB hole composite machining method. The method comprises two or more PCB hole drilling machining processes; the method is characterized in that a positioning hole is drilled, initial positioning is carried out, a one-time hole is drilled, process conversion is carried out, calibration positioning is performed, and machining is precise. Advantages of laser drilling and mechanical drilling are sufficiently combined, the problems that laser drilling is unilaterally adopted, the hole roundness is insufficient, the hole heat influence area is large, the recast layer is serious, and a conical hole is large in upper and small in lower can be solved, the limitation of laser machining depth is broken through, the problems that due to the fact that mechanical drilling isadopted unilaterally, machining burrs, drilling sewage in the hole, drilling cutting winding and tool breakage are caused can be solved, and limiting of machining of micro holes can be broken through.

Description

technical field [0001] The invention relates to the field of PCB drilling processing, in particular to a compound processing method for PCB holes. Background technique [0002] Printed electronic circuit (PCB) is a motherboard that fixes and assembles electronic components and realizes circuit connections between components. As a basic component in the advanced electronic information manufacturing industry, PCB's development level can reflect the development speed and technical level of a country or region's electronics industry to a certain extent. [0003] In recent years, the application and innovation of mobile Internet, cloud computing, big data, and Internet of Things have become increasingly active, and high-end PCB manufacturing with stronger performance and better efficiency has shown a trend of high-frequency, high-speed, light, small, high-density and multi-layered, making PCB It has the characteristics of complex structure, high hardness, large plate thickness, ...

AI Technical Summary

Problems solved by technology

[0007] At present, there are still difficulties in chip removal for mechanical drilling on PCB, resulting in processing burrs, drilling dirt in the hole, and entanglement of drill chips, especially for micro-holes (the ratio of board thickness to hole diameter > 10:1) and back drilling. Difficult to control fracture, size and shape accuracy

However, laser drilling of blind holes has problems such as poor hole shape and hole roundness, large taper deviation of upper and lower holes, serious heat-affected zone and recasting layer, and difficulty in ultra-micro hole processing.