A kind of alkali-resistant high temperature resistant thermosetting resin and its application
A solid resin, high-resistance technology, applied in the field of resin binders, can solve the problems of resin/silicon carbide ceramics with poor impact resistance, poor wear resistance, inability to meet high temperature and strong alkali operating environment, uneven distribution of silicon carbide particles, etc. Achieve the effect of improving rigidity, improving stability and tear resistance, and improving flexural strength
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Embodiment 1
[0027] An alkali-resistant and high-temperature resistant thermosetting resin, comprising the following components in parts by weight:
[0028]
[0029] Using the alkali-resistant and high-temperature resistant thermosetting resin of this embodiment to prepare resin / silicon carbide ceramics, the preparation process includes the following steps:
[0030] S1, weigh the epoxy resin E51, novolac epoxy resin, polyethylene terephthalate, glass fiber, phenyltrialkoxysilane, ethylenediamine, benzyldimethylamine and n-butyl Glycidyl ether, mixed with 500 parts of silicon carbide particles with a particle size of 1 to 3 mm and stirred evenly to obtain a solidified material;
[0031] S2, under the condition of 120° C., the curing material is cured for 3 hours to prepare resin / silicon carbide ceramics.
Embodiment 2
[0033] An alkali-resistant and high-temperature resistant thermosetting resin, comprising the following components in parts by weight:
[0034]
[0035] Using the alkali-resistant and high-temperature resistant thermosetting resin of this embodiment to prepare resin / silicon carbide ceramics, the preparation process includes the following steps:
[0036] S1, weigh the epoxy resin E44, phenolic epoxy resin, polyethylene terephthalate, asbestos-free mineral fiber, methylphenyldialkoxysilane, m-xylylenediamine, high The carbon number aliphatic diamine, triethylenediamine and phenyl glycidyl ether are mixed with 600 parts of silicon carbide particles with a particle size of 1-3mm and stirred evenly to obtain a cured material;
[0037] S2, under the condition of 70° C., the curing material is cured for 3 hours to prepare resin / silicon carbide ceramics.
Embodiment 3
[0039] An alkali-resistant and high-temperature resistant thermosetting resin, comprising the following components in parts by weight:
[0040]
[0041] Using the alkali-resistant and high-temperature resistant thermosetting resin of this embodiment to prepare resin / silicon carbide ceramics, the preparation process includes the following steps:
[0042] S1, weigh the epoxy resin E31, phenolic epoxy resin, polyethylene terephthalate, aramid fiber, diphenyldialkoxysilane, diethylenetriamine, N, N' -Dimethylpiperazine, boric acid, and allyl glycidyl ether are mixed with 700 parts of graded silicon carbide particles and stirred evenly to obtain a solidified material;
[0043] S2, curing the cured material at 100° C. for 2 hours to prepare resin / silicon carbide ceramics, the resin / silicon carbide ceramics has a diameter of 2 m.
[0044] In this embodiment, the graded silicon carbide particles include silicon carbide particles with the following particle sizes in parts by weight...
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