A kind of sealing process of full lamination liquid crystal module

Abstract

A sealing process for full-fit liquid crystal modules, where the iron frame and liquid crystal panel of the full-fit liquid crystal module can be exposed to ultraviolet light and double-cured transparent silicone gel, and then the LED light curing lamp is tilted at 38-42° The transparent silicone gel that can be dual-cured by ultraviolet light and heat is irradiated at an angle, and then cured by heating. The invention does not need to disassemble the iron frame of the mold group for operation, which greatly improves the operation efficiency and yield rate, and the product turnover time is shortened from 6 hours to 1 minute.

Description

technical field [0001] The invention relates to a fully laminating liquid crystal module sealing process, which belongs to the technical field of fully laminating liquid crystal modules. Background technique [0002] The structure of the traditional touch screen generally consists of three pieces: CG + touch screen + LCD screen, which need to be pasted twice during the assembly process. Among them, the bonding of the touch screen and the LCD screen generally adopts the method of frame stickers (double-sided adhesive tape), and there is a layer of air between the LCD screen and the touch screen. Because the refractive index of air and glass is different, every time light passes through the interface between glass and air, it will cause a reflection. The more interface layers, the more times of reflection will occur, resulting in the loss of the light source provided by the backlight of the LCD screen. At the same time, the external light will be reflected by these interface ...

AI Technical Summary

Problems solved by technology

Disadvantages: easy to produce tape wrinkles, air bubbles, low success rate of repair, etc.

[0005] Fully bonded LCD modules usually use an iron frame. There are two ways to seal the traditional iron frame. One is to remove the iron frame above the LCD module first, apply high-viscosity moisture-cured glue on the edge of the TFT, and then Re-fasten the iron frame to the LCD screen. This method has many disadvantages. First, in the process of removing the iron frame, sometimes it is easy to pull the FPC end of the LCD module, resulting in product function damage. Second, the glue is cured. It takes a long time, generally more than 6 hours to fully cure

The other is to dot a circle of high-viscosity acrylic glue on the edge of the iron frame of the module, and then dry it directly with UV light. The disadvantage of this dispensing method is that the shrinkage rate of UV glue is relatively large during the curing process. , generally at 2% to 3.5%. During the curing process, stress will be generated between the iron frame of the module and the LCD screen, which will cause light leakage on the LCD screen. The second is that acrylic UV glue is cured by UV light. If the iron frame The gap between the liquid crystal panel and the liquid crystal panel is irregular. After the glue is applied, part of it seeps into the iron frame. The UV light does not reach the glue and causes the glue to not cure. It flows into the backlight and causes defects. The curing energy of the surface glue is different, and there will be a color difference where the two glues are in contact, resulting in poor appearance

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