Structure and applications of high tensile strength and fast curing adhesive for metal surface

A high tensile strength, fast curing technology, used in adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of poor toughness, slow curing, and cannot be widely used, and achieve the effect of improving tensile strength.

Pending Publication Date: 2019-06-04
DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to its high bonding strength and strong versatility, epoxy adhesives are known as "universal glue" and "vigorous glue". Widely used, but due to the

Method used

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  • Structure and applications of high tensile strength and fast curing adhesive for metal surface
  • Structure and applications of high tensile strength and fast curing adhesive for metal surface
  • Structure and applications of high tensile strength and fast curing adhesive for metal surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Experiment No. J1:

[0032] 1. Preparation of organic bottom layer: mix epoxy resin SM828, curing agent polyamide 650, and toughening agent liquid rubber at room temperature in a mass ratio of 7:2:1 to obtain a light yellow transparent liquid. Coating on one side surface of 100×25×1.6mm steel plate after derusting, coating thickness is 2mm.

[0033] 2. Preparation of fiber reinforcement layer: before the organic bottom layer is solidified, spread a layer of No. 4 alkali-free glass cloth (soaked with fiber impregnating glue) on it. The layer thickness is 0.5 mm.

[0034] 3. Preparation of organic surface layer: After mixing epoxy resin SM828, curing agent polyamide 650, and toughening agent liquid rubber at room temperature in a mass ratio of 7:2:1, a light yellow transparent liquid is obtained. The organic material is coated on the fiber reinforcement layer with a coating thickness of about 1 mm to prepare an adhesive with a total thickness of 3.5 mm.

[0035] 4. Cov...

Embodiment 2

[0037] Experiment No. J2:

[0038] 1. Preparation of organic bottom layer: Mix epoxy resin SM828, curing agent polyamide 650, and toughening agent liquid rubber at room temperature in a mass ratio of 7:2:1 to obtain a light yellow transparent liquid. Coating on one side surface of 100×25×1.6mm steel plate after derusting, coating thickness is 2mm.

[0039] Vertically and evenly place 3*10 cylindrical fixed structures with a height of 0.5 mm and a diameter of 1 mm on the base layer, and the material is steel. Inserted with basal layer 0.2mm.

[0040] 2. Preparation of the fiber reinforcement layer: before the organic bottom layer is cured, two layers of No. 4 alkali-free glass cloth (soaked with fiber impregnating glue) are laid on it. The layer thickness is 0.8 mm.

[0041] Open evenly on the fiber reinforced layer, 2*4 grooves with a diameter of 2mm running through the fiber reinforced layer.

[0042] 3. Preparation of organic surface layer: After mixing epoxy resin SM828...

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Abstract

The invention relates to a preparation method of a high tensile strength and fast curing adhesive, wherein the adhesive has a sandwich structure comprising an organic bottom layer, a fiber reinforcinglayer and an organic surface layer, the organic bottom layer and the organic surface layer respectively comprise an epoxy resin, a curing agent polyamide and a toughening agent liquid-state rubber, and the fiber reinforcing layer comprises glass fibers impregnated with a fiber impregnating glue. According to the present invention, the adhesive has characteristics of simple formula, easily available raw materials and simple production, can be used for the adhesion between metal contact surfaces and inorganic material contact surfaces, further has advantages of excellent flowability and fast curing, has high mechanical strength, strong structure toughness, excellent corrosion resistance and excellent water resistance after being cured, and has significant adhesion effects in the fields of aerospace, shipbuilding, bridge reinforcement and the like..

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a high-tensile-strength, fast-curing adhesive used between metal and non-metal surfaces and joints. Background technique [0002] Epoxy adhesives are mainly composed of epoxy resin and curing agent. In order to improve its performance and meet different purposes, auxiliary materials such as tougheners, diluents, accelerators, and coupling agents can also be added. Due to its high bonding strength and strong versatility, epoxy adhesives are known as "universal glue" and "vigorous glue". However, due to the poor toughness, slow curing and low tensile strength of the existing epoxy adhesives, it cannot be widely used in ships, aerospace and other industries. Contents of the invention [0003] In order to avoid the shortcomings of current epoxy adhesives such as poor willfulness, full curing, and low tensile strength, this application discloses a high tensile strength, fast-curi...

Claims

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Application Information

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IPC IPC(8): C09J7/30C09J7/21C09J7/29C09J163/00C09J11/08
Inventor 鹿小林马磊张巍王国鹏赵许群王晓东
Owner DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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