Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A bottom plate packaging device of a micro-fluidic chip

A technology of microfluidic chips and packaging devices, which is applied in the field of microfluidics, can solve the problems of long processing cycle, large channel roughness, and difficulty in mass production, and achieve complex operability, shorten process cycle, and save time. Effect

Active Publication Date: 2019-06-07
深圳博华仕科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]In the prior art, in the microfluidic chip processing technology, there are mainly methods such as laser engraving, chemical etching, and photolithography. These methods have their own advantages and disadvantages. The disadvantages are complex operation, long processing cycle, material selection, large channel roughness, and poor repeatability, and it is difficult to produce in batches, so it is difficult to be used as a general and effective chip processing method
With the development of modern numerical control micromachining technology, its processing accuracy and scale can meet the technical requirements of microfluidic chips, but the existing numerical control micromachining equipment is not designed for the design and processing of microfluidic chips , causing unnecessary waste and destruction of materials in application
[0005]Therefore, there is still a lot of room for development in the existing technology

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A bottom plate packaging device of a micro-fluidic chip
  • A bottom plate packaging device of a micro-fluidic chip
  • A bottom plate packaging device of a micro-fluidic chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0041] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Mutually

[0042] For the positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0043]...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
hardnessaaaaaaaaaa
hardnessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a bottom plate packaging device of a micro-fluidic chip. The bottom plate packaging device of the micro-fluidic chip comprises a first conveying assembly, a second gluing assembly, and a first pressing assembly; the first pressing assembly comprises a first pressing roller and a second pressing cylinder which correspond to each other and are used for laminating the first material layer with the packaging adhesive layer and an electric plate strip positioned above the first conveying base material to form a micro-fluidic chip strip, and the micro-fluidic chip is printedby using a printing principle in combination with a micro-fluidic chip manufacturing process.

Description

technical field [0001] The invention relates to the field of microfluidic technology, in particular to a bottom plate packaging device for a microfluidic chip. Background technique [0002] Microfluidic chip is a new interdisciplinary field and an important development frontier in many fields such as analytical science, micro-electromechanical processing, life science, chemical synthesis, analytical instruments and environmental science in the new century. [0003] The processing technology of microfluidic analysis chips originated from the microfabrication of semiconductor and integrated circuit chips, but the processing size of the chip channel is much larger than that of large-scale integrated circuits. The size of the chip is about a few square centimeters, and the width and depth of the microchannel are on the order of microns. On the other hand, the selection of chip materials, the design of microchannels, the surface modification of microchannels and the fabrication o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B01L3/00
Inventor 林森冯洁云刘俊杰钟伟兴钟华
Owner 深圳博华仕科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com