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Laser processing device and laser processing method

A laser processing and laser technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of high laser absorption rate and low laser absorption rate, and achieve the effect of improving laser processing speed

Active Publication Date: 2019-07-05
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, at the beginning of laser processing, since the workpiece is solid, the laser absorption rate is low, but when the workpiece starts to melt, the laser absorption rate becomes high

Method used

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  • Laser processing device and laser processing method
  • Laser processing device and laser processing method
  • Laser processing device and laser processing method

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0026] Such as figure 1 as well as figure 2 As shown, the laser processing device 1 is provided with: a laser oscillator 100 as a laser source; a laser switching machine 70 (laser switching unit) selectively switches the optical path of the laser beam 110 to a first optical path and a second optical path; a processing head 80 ( A laser irradiation unit) irradiates the workpiece 900 with laser light; and the first optical fiber 11 and the second optical fiber 21 constitute a first optical path and a second optical path.

[0027] The laser oscillator 100 emits, for example, a high-output laser beam with a center wavelength of 976 nm and a near-infrared wavelength of 4 kW. The laser oscillator 100 is provided with a control unit 101 that performs various controls related to the operation of the laser processing apparatus 1 .

[0028] The laser switching machine 70 has: a bending module 72, which refracts the laser light emitted from the laser oscillator 100 and changes the op...

Embodiment approach 2

[0072] Hereinafter, the same reference numerals are assigned to the same parts as those in Embodiment 1, and only the different points will be described.

[0073] Such as image 3 as well as Figure 4 As shown, the processing head 380 is used for laser processing (laser welding in this embodiment) of workpieces 901 and 902 to be processed. The workpieces 901 and 902 are, for example, stainless steel plates (SUS) with a thickness of 0.8 mm.

[0074] The processing head 380 has: a head main body 381; the first fiber coupling module 33 is connected to the exit end of the first optical fiber 11 to guide its exit light to the head main body 381; and the second fiber coupling module 43 is connected to the exit end of the second optical fiber 21. end to guide the emitted light to the head main body 381 .

[0075] The head main body 381 includes: a reflecting mirror 350 for changing the optical path of the laser light guided into the head main body 381 by bending; For welding use....

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Abstract

A laser processing device (1) is provided with a laser switching unit (70) for switching a light path for one laser light beam (110) between a first light path having a first fiber (11) and a second light path having a second fiber (21) with a core diameter larger than the first fiber (11), and a processing head (80) for irradiating the same processing point on a workpiece (900) with laser light passing through the first light path or the second light path. The laser switching unit (70) switches the light path for the laser light to the second light path from the first light path when a prescribed time has elapsed for the irradiation time for the laser light passing through the first light path.

Description

technical field [0001] The present invention relates to a laser processing device and a laser processing method for increasing processing speed. Background technique [0002] Conventionally, it is known that the absorption rate of laser light in metal, which is a typical workpiece, is low in a solid state and high in a molten state (for example, refer to Patent Document 1). That is, at the start of laser processing, since the workpiece is solid, the absorption rate of the laser light is low, but when the workpiece starts to melt, the absorption rate of the laser light becomes high. [0003] In addition, in laser processing, the converging diameter of a laser beam suitable for the processing is known (for example, refer to Patent Document 2). [0004] Furthermore, in order to separately use a laser beam with a focal diameter suitable for melting and a laser beam with a focal diameter suitable for laser processing, it is known to irradiate a plurality of laser beams emitted f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/067B23K26/064G02B6/42
CPCB23K26/067B23K26/032B23K26/0643B23K26/0648B23K26/38G02B6/42B23K26/064B23K26/0613B23K26/073
Inventor 长安同庆西村仁志王静波龙堂诚西尾正敏山口秀明竹中义彰江泉清隆石川谅
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD