Sn-Ti-Cu ternary alloy welding flux used for sealing of quartz glass
A sn-ti-cu, ternary alloy technology, applied in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of high equipment condition requirements and complex processes, and improve the reliability of vacuum sealing, The effect of simple sealing process, improved service life and operational reliability
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Embodiment 1
[0027] The substrate of the Sn-Ti-Cu ternary alloy solder for quartz glass sealing in this embodiment is tin, and the introduced Ti and Cu are composed of Ti: 0.1% and Cu: 1.0% according to weight percentage, and the introduced O is according to atomic percentage. The component is O: 0.05%. The melting point of the ternary alloy solder is 231.9°C. The ternary alloy solder is a sheet with a thickness of 0.2mm.
Embodiment 2
[0029] The substrate of the Sn-Ti-Cu ternary alloy solder for quartz glass sealing in this embodiment is tin, the introduced Ti and Cu are composed of Ti: 2.0% and Cu: 0.1% according to weight percentage, and the introduced O is according to atomic percentage The composition is O: 4.9%. The melting point of the ternary alloy solder is 231.9°C. The ternary alloy solder is a sheet with a thickness of 0.4mm.
Embodiment 3
[0031] The substrate of the Sn-Ti-Cu ternary alloy solder for quartz glass sealing in this embodiment is tin, the introduced Ti and Cu are composed of Ti: 0.4% and Cu: 0.2% according to weight percentage, and the introduced O is according to atomic percentage The composition is O: 1.9%. The melting point of the ternary alloy solder is 231.9°C. The ternary alloy solder is a sheet with a thickness of 0.25mm.
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