A kind of cu-cuo containing three-dimensional porous structure x Preparation method of heterostructure
A heterogeneous structure, three-dimensional porous technology, applied in chemical instruments and methods, chemical/physical processes, physical/chemical process catalysts, etc., can solve the problems of low cost, inability to completely remove impurities, etc., and achieve easy storage and excellent product selection properties, high specific surface area
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[0033] In the specific implementation process, the present invention provides a Cu-CuO containing three-dimensional porous structure x The preparation method of the heterogeneous structure is to use commercial copper as the starting material, soak it in a certain concentration of acidic solution for a short period of time, wash it with deionized water and dry it, place it on a burning boat, put it in a muffle furnace Heat treatment in an oxygen-containing atmosphere to obtain the intermediate product CuO x , and then placed in a tube furnace for heat treatment in a reducing atmosphere to obtain Cu-CuO with a three-dimensional porous structure x heterogeneous structure. Thus, the Cu-CuO with three-dimensional porous structure can be regulated by changing the reaction time during heat treatment. x The composition ratio of the heterostructure is specifically characterized by:
[0034] 1. The starting materials used are one or more of various commercial copper foils, copper all...
Embodiment 1
[0042] In this embodiment, the commercial copper foil is cut into a rectangle with a length of 1 cm × a width of 2 cm (in this embodiment, the thickness of the commercial copper foil is 0.25 mm), and it is placed in a 15 mL container containing 0.65 M (molar concentration) H +(In this example, H + Soak in an aqueous solution of HCl for 5-10s, wash with deionized water and dry in a nitrogen atmosphere, and then put it into a muffle furnace and treat it in an air atmosphere at 900°C for 0.5h to obtain an intermediate product CuO with a rough surface. x (0≤xx heterogeneous structure. In the heterostructure, Cu accounts for 11wt%, CuO x Accounting for 89 wt%.
[0043] Such as figure 1 Shown, the XRD diffraction peak of the starting material commercial copper foil used; figure 2 As shown, the surface of the commercial copper foil used as the starting material is relatively smooth and the roughness is small; image 3 As shown, the intermediate product CuO used x Composed of c...
Embodiment 2
[0045] In this embodiment, the commercial copper foil is cut into a rectangle with a length of 1 cm × a width of 2 cm (in this embodiment, the thickness of the commercial copper foil is 0.25 mm), and it is placed in a 15 mL container containing 0.65 M (molar concentration) H + (In this example, H + Soak in an aqueous solution of HCl for 5-10s, wash with deionized water and dry in a nitrogen atmosphere, and then put it into a muffle furnace and treat it in an air atmosphere at 900°C for 0.5h to obtain an intermediate product CuO with a rough surface. x (0≤xx heterogeneous structure. In the heterostructure, Cu accounts for 31wt%, CuO x Accounting for 69 wt%. The pore size distribution range of the three-dimensional porous structure is 10 nm to 1 μm, and the porosity is 31%.
[0046] Such as Figure 9 As shown, Cu-CuO rich in three-dimensional porous structure x The heterostructure exists in the center of the sample and its surface, and the heterostructure interface is obvio...
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Abstract
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