A copper-based microcrystalline alloy and its preparation method and an electronic product
A technology for microcrystalline alloys and electronic products, applied in the field of copper-based microcrystalline alloys and their preparation, can solve the problems of unsatisfactory casting performance, difficulty in meeting the technical requirements of modern products, low corrosion resistance and mechanical strength of copper alloys, and the like. Good formability, high mechanical strength, good flow properties
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Embodiment 1
[0057] Copper-based microcrystalline alloy raw materials were prepared according to the composition in Table 1. The copper-based microcrystalline alloy raw material is subjected to vacuum melting. Among them, the vacuum smelting process is: using a vacuum smelting furnace, evacuate to below 5Pa and feed argon gas, preheat the furnace body at 20kW for 5 minutes, then heat at 50-60kW to 1120°C, keep it warm for 8 minutes for casting Get ingots.
[0058] After the obtained ingot is melted, semi-solid die-casting is performed on a cold die-casting machine DCC160 to obtain a die-cast body of the copper-based microcrystalline alloy of the present invention. Among them, the conditions of semi-solid die-casting include: the casting temperature is 950°C, the injection speed is 0.9m / s, the mold cavity temperature is 250°C, the holding time is 3s, the starting point of the first injection is 150mm, and the starting point of the second injection is 195mm .
[0059] The property paramet...
Embodiment 2-3
[0061] The copper-based microcrystalline alloy was prepared by the same method as in Example 1, except that the copper-based microcrystalline alloy raw material was prepared according to the composition given in Table 1. The property parameters of the prepared Cu-based microcrystalline alloys are listed in Table 2.
[0062] Among them, in Example 2, the conditions of semi-solid die-casting include: the casting temperature is 950°C, the injection speed is 1.0m / s, the mold cavity temperature is 250°C, the holding time is 3s, the starting point of the first shot is 145mm, and the second shot The injection starting point is 195mm;
Embodiment 3
[0063] In Example 3, the conditions of semi-solid die-casting include: the casting temperature is 960°C, the injection speed is 1.2m / s, the mold cavity temperature is 195°C, the holding time is 3s, the starting point of the first shot is 145mm, and the second shot The starting point is 195mm.
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Abstract
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