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Surface-treated copper foil for high-speed printed circuit board products including copper foil and method of manufacture

A technology of surface treatment and high-speed printing, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit parts, etc., and can solve problems such as signal loss

Active Publication Date: 2020-04-14
CHANG CHUN PETROCHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] After many studies, the inventors of the present invention found that the copper foil with roughened particle treatment on the surface of the roller has a surface roughness (Rz) of 1.5 to 3.1 μm and a surface roughness (Rz) of 15% to 30%. The difference between the reflectivity at 570nm and the reflectivity at 610nm can solve the problem of signal loss

Method used

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  • Surface-treated copper foil for high-speed printed circuit board products including copper foil and method of manufacture
  • Surface-treated copper foil for high-speed printed circuit board products including copper foil and method of manufacture
  • Surface-treated copper foil for high-speed printed circuit board products including copper foil and method of manufacture

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Roller polishing with buffing wheels

[0076] Roller speed: 1.0-5.0m / min

[0077] Polishing wheel speed: 150-550rpm (#1500, Nippon Tokushu Kento Co., Ltd.)

[0078] Load current: 0.5-1.5A

[0079] Preparation of electrolytic copper foil (untreated copper foil)

[0080] Copper wire was dissolved in 50% by weight of sulfuric acid aqueous solution to prepare 320g / L copper sulfate pentahydrate (CuSO 4 ·5H 2 O) and the copper sulfate electrolyte of 100g / L sulfuric acid. For each liter of copper sulfate electrolyte, 20 mg chloride ion, 0.35 mg gelatin (DV, Nippi Company) were added. Subsequently, at a liquid temperature of 50°C and 70A / dm 2 An electrolytic copper foil (untreated copper foil) with a thickness of 18 μm was prepared at a current density of 100 μm.

[0081] A typical apparatus for preparing electrolytic copper foil includes a metal cathode roll and an insoluble metal anode, generally as image 3 As shown, the metal cathode roll rotates about a central lon...

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Abstract

A surface-treated copper foil for high-speed circuits of 100MHz or higher, which refers to the reverse treatment of electrolytic copper foil, that is, the formation of copper roughened particles on the surface of the roller to form a laminated surface, and then paste bonded to a dielectric material to form a copper foil substrate. The invention also describes methods of forming surface treated copper foils and printed circuit boards (PCBs) made from copper foil substrates. Surface-treated copper foils, copper foil substrates, and PCBs can be incorporated into various electronic devices that use high-speed signals, including personal computers, mobile communication devices including mobile phones and wearable devices, self-driving cars including cars and trucks, including passenger Or unmanned aerial devices, and vehicles, wherein manned or unmanned vehicles include aircraft, unmanned aerial vehicles, missiles, and space facilities including artificial satellites, spacecraft, space stations and alien living environments.

Description

technical field [0001] The present disclosure relates to a copper foil capable of immediately transmitting high-frequency electronic signals on the order of 100 MHz or more, which allows current to pass only through the surface of a conductor to reduce the skin effect. Also disclosed are printed circuit boards (PCBs) incorporating copper foil and electronic circuitry, and devices incorporating copper foil. Also disclosed are methods of preparing copper foil and products incorporating the same. Background technique [0002] Higher frequency electronic signals have become a requirement for new electronic devices, such as personal computers, mobile communication devices including mobile phones and wearable devices, self-driving vehicles including cars and trucks, aviation devices including manned or unmanned vehicles , and vehicles, where manned or unmanned vehicles include aircraft, unmanned aerial vehicles, missiles, and space facilities including artificial satellites, spac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04C25D5/02C25D5/12C25D5/48C25D7/06C25D15/00C25F3/26H05K3/02
CPCC25D5/12C25D5/14C25D1/04C25D5/028C25D5/48C25D7/0614C25D15/00C25F3/26C25D5/605H05K3/022B32B15/01C25D3/08C25D3/12C25D3/38H05K3/025H05K3/384H05K3/389H05K2203/0307C23C28/3225C23C28/34C23C2222/20C25D11/36H05K1/09B05D1/02B32B15/08B32B2457/08C25D1/10H05K1/0242H05K3/188H05K2203/0134H05K2203/0723
Inventor 赖耀生郑桂森周瑞昌
Owner CHANG CHUN PETROCHEMICAL CO LTD