Thermal grid scanning thermal wave lossless film thickness detection method
A technology for film thickness and non-destructive testing, which is applied in the direction of measuring devices, instruments, and optical devices. It can solve the problems of extremely high sampling frequency or signal sensitivity of thermal imagers, achieve low sampling frequency requirements, and reduce sampling frequency and signal sensitivity. Requirements, the effect of low signal sensitivity requirements
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Embodiment 1
[0031] Comply with the above technical solutions, such as figure 1 As shown, this embodiment provides a thermal grid scanning thermal wave non-destructive film thickness detection method, the detection method steps are as follows:
[0032] Example 1 can detect ceramic thin films.
[0033] In order to facilitate the understanding of the implementation of this patent, specific application descriptions are given below for the implementation of the present invention.
[0034] The detection frequency is 0.02Hz, the wavelength of the thermal grid is 1-40cm, the size of the specimen is 40cm×4cm×1cm, and the surface is sprayed with yttria-stabilized zirconia (8wt.% YSZ) by APS to prepare a TBC coating with a thickness of 200μm.
[0035] (1) The moving grating image is generated by computer software, and the projector is used to project on the surface of the film. In order to enhance the thermal wave signal, it is better to use a traditional thermal light source projector instead of L...
Embodiment 2
[0041] Comply with the above technical scheme, use MATLAB to carry out numerical simulation analysis, and verify with the experimental results, the steps of this detection method are as follows:
[0042] Embodiment 2 can detect metal materials.
[0043] The detection frequency is 0.02Hz, the wavelength of the thermal grid is 0.1-2cm, the size of the specimen is 1cm×0.3cm×0.1cm, and the material is 405 stainless steel.
[0044] In order to facilitate the understanding of the implementation of the invention, specific application descriptions are given below for the implementation of the invention.
[0045] (1) The heat source loading form is 100*sin(0.04π*t+u*x), the initial temperature is 0, and the boundary conditions are adiabatic boundary conditions on all surfaces except the heating surface;
[0046] (2) Write the heat conduction calculation program by yourself, and get the temperature change law of each point on the surface of the test piece with time;
[0047] (3) Fit t...
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