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Graphene Oriented Thermally Conductive Double-sided Tape

A technology of directional thermal conductivity and double-sided adhesive tape, which is applied in the direction of adhesives, epoxy resin adhesives, film/sheet adhesives, etc., which can solve the problems of prone to residual adhesive and small thermal conductivity of thermally conductive double-sided adhesive tape, and achieve sustainable Good removability, high cohesion, and high thermal conductivity

Active Publication Date: 2021-08-13
斯迪克新型材料(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current method of preparing thermally conductive tape is to add thermally conductive fillers to the colloid to achieve the purpose of heat conduction, but the thermal conductivity of the current thermally conductive double-sided adhesive tape is generally relatively small, and the colloid is prone to residual glue when it is removed after working in a high temperature environment for a long time Case

Method used

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  • Graphene Oriented Thermally Conductive Double-sided Tape

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Experimental program
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Embodiment 1~4

[0031] Embodiments 1 to 4: A graphene oriented thermally conductive double-sided tape, including a glass fiber cloth base layer, a thermally conductive adhesive layer coated on both sides of the glass fiber cloth base material layer, and a thermally conductive adhesive layer that is opposite to the glass fiber cloth layer. A release film layer on one side of the fiber cloth substrate layer;

[0032] The thickness of the above-mentioned glass fiber cloth base material layer is 30 μm, and the thickness of the above-mentioned thermally conductive adhesive layer is 15 μm;

[0033] The above-mentioned thermally conductive adhesive layer is composed of the following components in parts by weight:

[0034] Table 1

[0035]

[0036] The molecular weight of the above-mentioned hydroxyl-terminated polysiloxane is 200,000-300,000, and the hydroxyl content of the above-mentioned hydroxyl-terminated polysiloxane is 0.3-1.5%.

[0037] The organotin catalyst of the above-mentioned embod...

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Abstract

The invention discloses a graphene oriented heat-conducting double-sided adhesive tape, which comprises a glass fiber cloth base material layer, a heat-conducting adhesive layer coated on both sides of the glass fiber cloth base material layer, and a heat-conducting adhesive layer pasted on the glass fiber cloth The release film layer on one side of the substrate layer, the thermally conductive adhesive layer is composed of the following components in parts by weight: 30-45 parts of hydroxyl-terminated polysiloxane, 10-18 parts of epoxy resin, 30-40 parts of MQ resin, 2~5 parts of tetraethoxysilane, 1~3 parts of isobutyltriethoxysilane, 0.1~1 part of isopropyl titanate, 25~40 parts of graphene powder, 5~10 parts of nano boron nitride, 2~6 parts of vinyltoluene, 5~10 parts of 3‑mercaptopropyltriethoxysilane, 0.1~1 part of ethoxylated acetylene glycol, 0.1~3 parts of organotin catalyst, 55~70 parts of organic solvent; The graphene oriented thermally conductive double-sided adhesive tape of the present invention has high thermal conductivity, and has no obvious adhesive residue after damp heat aging, and has good removability.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to a graphene oriented thermally conductive double-sided adhesive tape. Background technique [0002] With the rapid development of the electronics industry, electronic products tend to be lighter and smaller, so the integration of electronic components is getting higher and higher, so the requirements for the conduction and heat dissipation performance of electronic components are getting higher and higher. Thermally conductive tape is widely used because of its function of heat conduction and bonding, and it has the characteristics of softness, compressibility, compliance and wide temperature range, so it occupies a large market for thermally conductive materials. [0003] The current method of preparing thermally conductive tape is to add thermally conductive fillers to the colloid to achieve the purpose of heat conduction, but the thermal conductivity of the current thermally conductive doubl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/21C09J7/40C09J183/04C09J163/00C09J11/06C09J11/04
CPCC08K2003/385C08K2201/011C08L2205/025C08L2205/03C09J11/04C09J11/06C09J183/04C09J7/21C09J7/40C09J2301/122C09J2301/30C08L83/04C08L63/00C08K13/02C08K3/042C08K3/38C08K5/06C08K5/548C08K5/5415C08K5/5419C08K5/01
Inventor 金闯张庆杰
Owner 斯迪克新型材料(江苏)有限公司