Double-layer thermal barrier/high-temperature low-infrared emissivity integrated coating, metal composite material with coating and preparation method thereof

A low-infrared emission, metal alloy technology, applied in coating, superimposed layer plating, metal material coating process, etc., can solve the problems of delamination, peeling, coating cracks, etc.

Active Publication Date: 2019-07-26
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the stress in the coating accumulates to a certain extent, it is easy to cause cracks, delamination and peeling

Method used

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  • Double-layer thermal barrier/high-temperature low-infrared emissivity integrated coating, metal composite material with coating and preparation method thereof
  • Double-layer thermal barrier/high-temperature low-infrared emissivity integrated coating, metal composite material with coating and preparation method thereof
  • Double-layer thermal barrier/high-temperature low-infrared emissivity integrated coating, metal composite material with coating and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0061] Such as figure 1As shown, a double-layer thermal barrier / high temperature and low infrared emissivity integrated coating, the coating is a multi-layer superimposed structure, which includes a CoNiCrAlY metal bonding layer, a thermal barrier ceramic inner layer, and a thermal barrier ceramic outer layer from the inside to the outside. layer and low infrared emissivity layer. Among them, the material of the inner layer of thermal barrier ceramics is La 2 Zr 2 o 7 -8YSZ mixture, 8YSZ is 8% mass fraction of Y 2 o 3 Stabilized ZrO 2 ; La 2 Zr 2 o 7 Nano-powder accounted for 20% of the mass fraction of the mixture. The material of the outer layer of the thermal barrier ceramic is La 2 Zr 2 o 7 . The low infrared emissivity layer is Bi with conductive phase AuPt alloy powder 2 o 3 -Al 2 o 3 -ZrO 2 -CaO-SiO 2 It is a glass coating, and the AuPt conductive phase accounts for 85% of the mass fraction of the low infrared emissivity layer.

[0062] In this embod...

Embodiment 2

[0080]A double-layer thermal barrier / high-temperature low-infrared emissivity integrated coating, the coating is a multi-layer superimposed structure, including a CoNiCrAlY metal bonding layer, a thermal barrier ceramic inner layer, a thermal barrier ceramic outer layer and a low thermal barrier ceramic layer from the inside to the outside. Infrared emissivity layer. Among them, the material of the inner layer of thermal barrier ceramics is La 2 Zr 2 o 7 -8YSZ mixture, 8YSZ is 8% mass fraction of Y 2 o 3 Stabilized ZrO 2 ; La 2 Zr 2 o 7 The nano powder accounted for 10% of the mass fraction of the mixture. The material of the outer layer of thermal barrier ceramics is La 2 Zr 2 o 7 . The low infrared emissivity layer is Bi with conductive phase AuPt alloy powder 2 o 3 -Al 2 o 3 -ZrO 2 -CaO-SiO 2 It is a glass coating, and the AuPt conductive phase accounts for 85% of the mass fraction of the low infrared emissivity layer.

[0081] In this embodiment, the thi...

Embodiment 3

[0099]A double-layer thermal barrier / high-temperature low-infrared emissivity integrated coating, the coating is a multi-layer superimposed structure, including a CoNiCrAlY metal bonding layer, a thermal barrier ceramic inner layer, a thermal barrier ceramic outer layer and a low thermal barrier ceramic layer from the inside to the outside. Infrared emissivity layer. Among them, the material of the inner layer of thermal barrier ceramics is La 2 Zr 2 o 7 -8YSZ mixture, 8YSZ is 8% mass fraction of Y 2 o 3 Stabilized ZrO 2 ;La 2 Zr 2 o 7 Nano-powder accounted for 20% of the mass fraction of the mixture. The material of the outer layer of thermal barrier ceramics is Nd 2 Zr 2 o 7 . The low infrared emissivity layer is Bi with conductive phase AuPt alloy powder 2 o 3 -Al 2 o 3 -ZrO 2 -CaO-SiO 2 It is a glass coating, and the AuPt conductive phase accounts for 75% of the mass fraction of the low infrared emissivity layer.

[0100] In this embodiment, the thicknes...

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Abstract

The invention discloses a double-layer thermal barrier/high-temperature low-infrared emissivity integrated coating which is of a multilayer superposition structure. The multilayer superposition structure sequentially comprises a metal bonding layer, a thermal barrier ceramic inner layer, a thermal barrier ceramic outer layer and a low-infrared emissivity layer from inside to outside, and the thermal barrier ceramic inner layer is La2Zr2O7-8YSZ mixture layer, wherein the mass fraction of La2Zr2O7 powder in the mixture is not more than 45%, the thermal barrier ceramic outer layer is a rare earthzirconate layer, and the low-infrared emissivity layer is a Bi2O3-Al2O3-ZrO2-CaO-SiO2 glass coating comprising conductive phase AuPt alloy powder. The invention also provides a metal composite material with the coating and a preparation method thereof. The integrated coating has the characteristics of heat insulation performance, high-temperature low infrared emissivity, excellent thermal shock resistance and the like.

Description

technical field [0001] The invention belongs to the field of functional coatings and composite materials, in particular to a composite coating, a metal composite material and a preparation method thereof. Background technique [0002] With the continuous improvement of the thrust-to-weight ratio of aero-engines, high-temperature metal alloys need to be able to be used in higher temperature environments. Compared with improving the temperature resistance by optimizing the composition of the metal alloy, it is one of the fastest and most effective means to prepare thermal barrier coatings (Thermal Barrier Coatings, TBCs) on the surface of the metal alloy substrate by thermal spraying to improve its temperature resistance. one. Classic thermal barrier coatings usually include three parts: high temperature metal alloy substrate, metal bonding layer and ceramic surface layer. In a high-temperature gas environment, the high-temperature metal alloy substrate is separated from the...

Claims

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Application Information

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IPC IPC(8): C23C4/134C23C4/11C23C4/073C04B35/66C04B35/622C04B35/50C04B35/48C03C3/095C23C28/00
CPCC03C3/095C04B35/48C04B35/50C04B35/62222C04B35/66C23C28/3215C23C28/345C23C4/073C23C4/11C23C4/134
Inventor 黄文质刘海韬甘霞云黄丽华
Owner NAT UNIV OF DEFENSE TECH
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