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A kind of photosensitive resin with maleimide structure and its preparation method and application

A technology of maleimide and photosensitive resin, applied in the field of photosensitive resin with maleimide structure and its preparation, can solve the problems of high Dk/Df, low thermal conductivity and the like, and achieve the effect of low dielectric loss

Active Publication Date: 2022-04-22
ZHEJIANG YONGTAI NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that the Dk / Df of the traditional PCB solder resist ink is too high and the thermal conductivity is too low, the present invention provides a photosensitive resin with a maleimide structure and a preparation method thereof, which is not used in the preparation of PCB photosensitive and developing ink. The application on the surface not only ensures the lower dielectric constant / dielectric loss of photosensitive ink

Method used

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  • A kind of photosensitive resin with maleimide structure and its preparation method and application
  • A kind of photosensitive resin with maleimide structure and its preparation method and application
  • A kind of photosensitive resin with maleimide structure and its preparation method and application

Examples

Experimental program
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Effect test

Embodiment 1

[0039] Pour 30 grams of solvent N-methyl-2-pyrrolidone into a three-necked flask, add 11.1 grams of N-methylmaleimide and 9.3 grams of α-phenylethylamine, keep it warm at 120°C for 5 hours, and then add o-benzene 60 grams of xylenol epoxy resin was heated to 100° C. and kept at a temperature of 8 hours to obtain epoxy resin 1 with a maleimide structure.

[0040] Add 25 grams of N-methyl-2-pyrrolidone, 14.4 grams of acrylic acid, and 1 gram of triphenylphosphine to 105 grams of epoxy resin 1 with a maleimide structure and react at 100 ° C for 6 hours, and then add an anhydride-containing substance 25 grams of tetrahydrophthalic anhydride was heated to 130° C. for 1 hour to obtain photosensitive resin A having a maleimide structure.

Embodiment 2

[0042] Pour 80 grams of solvent γ-butyrolactone into a three-necked flask, add 26.1 grams of N, N-m-phenylene bismaleimide and 19.8 grams of cyclohexylamine, keep warm at 180°C for 2 hours, and then add phenol novolac ring 120 grams of epoxy resin was heated to 140° C. and kept at a temperature of 4 hours to obtain epoxy resin 2 with a maleimide structure.

[0043] Add 30 grams of γ-butyrolactone, 32.4 grams of methacrylic acid, and 1 gram of dimethylbenzylamine to 450 grams of epoxy resin 1 with a maleimide structure and react at 140 ° C for 1 hour, then add anhydride-containing substances 50 grams of hexahydrophthalic anhydride was heated to 100° C. for 4 hours to obtain a photosensitive resin B having a maleimide structure.

Embodiment 3

[0045] Pour 30 grams of solvent dimethylformamide into a three-necked flask, add 15 grams of N-isopropylmaleimide and 15.7 grams of α-phenylethylamine, keep warm at 100°C for 10 hours, and then add bisphenol A formaldehyde 75 grams of novolac epoxy resin was heated to 80° C. and kept at a temperature of 10 hours to obtain epoxy resin 3 with a maleimide structure.

[0046] Add 30 grams of solvent dimethylformamide, 22.0 grams of crotonic acid, and 1 gram of dimethylbenzylamine to 130 grams of epoxy resin 3 with a maleimide structure and react at 160 ° C for 3 hours, then add an acid anhydride 35.9 grams of methyl hexahydrophthalic anhydride was heated to 150° C. for 3 hours to obtain a photosensitive resin C having a maleimide structure.

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Abstract

The invention relates to the field of photosensitive resins. In order to solve the problems of too high Dk / Df and too low thermal conductivity of traditional PCB solder resist inks, the invention provides a photosensitive resin with a maleimide structure and a preparation method thereof. Application in the preparation of PCB photosensitive and developing ink, the epoxy resin with maleimide structure is reacted with unsaturated monocarboxylic acid in a solvent under the action of a catalyst and at a reaction temperature of 80-160°C for 1-10 hours Afterwards, react with acid anhydride-containing substances at a reaction temperature of 80-160°C for 1-10 hours to obtain a photosensitive resin with a maleimide structure. Not only does it ensure that the dielectric constant / dielectric loss of the photosensitive ink is low, but the thermal conductivity is also above 1.0.

Description

technical field [0001] The invention relates to the field of photosensitive resins, in particular to a photosensitive resin with a maleimide structure and a preparation method and application thereof. Background technique [0002] Printed CircuitBoard, referred to as "PCB", PCB is mainly composed of two types of materials, insulating substrate and conductor. The components necessary for most electronic equipment products, such as materials, are also known as the necessary components for most electronic equipment products, and are also known as the "mother of electronic products". 5G will start large-scale construction in 2019, which will drive the growth of communication PCB demand. [0003] 5G will bring major changes to the base station structure, and the usage and unit price of communication PCBs are expected to increase significantly. In the 4G era, a standard macro base station is mainly composed of three parts: a base band processing unit BBU (Base Band Unit), a radi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/101C09D11/102C09D11/03G03F7/027G03F7/004C08G59/17C08G59/40C08G59/42C08G59/50
CPCC09D11/101C09D11/03C09D11/102G03F7/027G03F7/004C08G59/4042C08G59/5033C08G59/1466C08G59/4215C08G59/5026
Inventor 何匡林宝明牟敏仁
Owner ZHEJIANG YONGTAI NEW MATERIAL CO LTD