Radar echo signal acquisition circuit chip based on SIP technology.

Abstract

The invention discloses a radar echo signal acquisition circuit chip based on an SIP technology. The radar echo signal acquisition circuit chip solves the problems that the traditional radar echo signal acquisition PCB has large size and high power consumption and is difficult to be applied to a space-limited platform. The radar echo signal acquisition circuit chip is composed of a metal casing and a multi-layer high-density ceramic circuit substrate with a cavity, wherein a signal acquisition module, a signal pre-processing module and a clock configuration module are installed and soldered onthe substrate. The radar echo signal acquisition circuit chip integrates FPGA, ADC, PROM and DDR3 bare chips on the multi-layer high-density ceramic circuit substrate by adopting the SIP technology,designs a radar echo signal acquisition circuit into a package, and reduces the circuit size, improves the signal integrity of the circuit and reduces power consumption of the circuit while realizinga radar echo signal acquisition function. The radar echo signal acquisition circuit chip regards an idle I / O pin on the FPGA as a user I / O, and has expansibility and flexibility. The radar echo signalacquisition circuit chip can be used for acquiring radar echo signals in a radar signal processing system, and realizes the miniaturization of the radar signal processing system.

Description

technical field [0001] The present invention relates to the field of electronic technology, and further relates to radar digital signal processing, specifically a radar echo signal acquisition circuit chip based on System In Package (SIP) technology, which can be applied to radar signal processing systems, real-time Collect the echo signal output by the radar and perform analog-to-digital conversion. Background technique [0002] As the functions of the radar signal processing system become more and more complex, the miniaturization and modularization of the system has become an inevitable requirement. At the same time, the demand for miniaturized, high-performance components is also increasing. However, traditional radar signal processing systems are all designed with PCB boards, which are large in size and high in power consumption. Moreover, some high-performance components used in domestic radar signal processing systems mostly use foreign chips, which have long been un...

AI Technical Summary

Problems solved by technology

Although the radar signal real-time acquisition system uses many highly integrated chips, the integration level has been improved, but it still uses a single board design, and all circuit modules are designed on a PCB board, which makes the integration level of the system not enough High, the whole system has a large volume and high power consumption

[0004] The existing radar echo signal acquisition circuits are mostly designed with PCB boards, which are large in size and high in power consumption, and are difficult to be used in platforms with limited space

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