A method for large-area transfer to prepare nanostructures
A nano-structure and large-area technology, applied in nanotechnology, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problem that it is difficult to ensure the uniformity of AAO nano-hole speed, hinder the application and promotion of AAO pattern transfer method, and the hole has not reached And other issues
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Embodiment 1
[0034] S1: Take an Al sheet with a purity of 99.99% and immerse it in a 0.3 mol / L oxalic acid solution, and perform the first oxidation at room temperature with a voltage of 40V for 1-2 minutes, preferably 2 minutes. Then, with 3 wt% H at 40 °C 3 PO 4 +1.2wt%H 2 CrO 4 After removing the oxide layer, the solution is put into 0.3 mol / L oxalic acid solution for the second oxidation for 3-6 minutes, preferably 5 minutes. Finally placed in the concentration of not more than 5wt% H 3 PO 4 solution, at 60°C, after the hole expansion is completed, take it out and dry it in the air to obtain the required single-pass AAO porous nanostructure template based on Al. The single-pass AAO porous nanostructure template has an AAO / Al composite structure, such as figure 1 shown.
[0035] S2: if figure 2 As shown, the surface of the single-pass AAO porous nanostructure template in the S1 step is spin-coated twice, and the first spin-coating uses 5% to 10%, preferably 6% PMMA-anisole solut...
Embodiment 2
[0041] Compared with Embodiment 1, this embodiment differs in that the specific operation of step S6 of this embodiment is different, specifically:
[0042] Such as Figure 5 As shown in (d)-(g), the SiO 2 Coating, then remove the AAO film layer, and then use SiO 2 For the mask, use SF 6 +O 2 dry etching, in SF 6 and O 2 The gas flow ratio is 10:12, the RF power is 110W, and the ICP power is 320W, and a cylindrical nanostructure is obtained on the surface of the target substrate. The structure is as follows Figure 7 shown.
Embodiment 3
[0044] Compared with Embodiment 2, this embodiment differs in that the specific operation of step S6 of this embodiment is:
[0045] After obtaining cylindrical nanostructures, such as Figure 5 As shown in steps (g) and (h), by SF 6 +C 4 f 8 Dry etching, controlled etching gas SF 6 and C 4 f 8 The gas flow ratio is 10:13. Under the conditions of RF power of 100W and ICP power of 300W, the cylindrical nanostructure is etched and modified for about 40s, and the following Figure 8 The parabolic-like nanostructure shown.
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