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Porous polyimide raw film, method for producing the same, and composition

A polyimide film blank film, polyimide film technology, applied in the field of porous polyimide film blank film, can solve the problems of weak force application, poor manufacturing suitability, etc., and achieves excellent manufacturing suitability, resistance to resistance. Excellent tensile strength and flexural strength

Active Publication Date: 2019-08-09
TOKYO OHKA KOGYO CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the porous polyimide membrane described in Cited Document 1 is weak against the applied force during production, and can only be produced in a monolithic manner, and its production suitability is poor.

Method used

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  • Porous polyimide raw film, method for producing the same, and composition
  • Porous polyimide raw film, method for producing the same, and composition
  • Porous polyimide raw film, method for producing the same, and composition

Examples

Experimental program
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Effect test

Embodiment 1

[0210] Using a homogenizer, 42 g of spherical silica (median average particle size is 280 nm, and particle size distribution index (d25 / d75) is 1.5 or less) is uniformly dispersed in 42 g of dimethylacetamide (DMAC) to obtain dioxide dioxide Silicon dispersion liquid 84g.

[0211] A DMAC solution of the polyamic acid 1 obtained above was prepared (the concentration of the polyamic acid 1 was 20% by mass), 52.5 g of this solution, 84 g of the above-mentioned silica dispersion, and 13.5 g of DMAC were mixed, and Rentaro (trade name) was used. , manufactured by Thinky Corporation) and uniformly mixed to obtain the polyimide precursor solution (composition) of Example 1 (with respect to the mass ratio, spherical silica: polyamic acid=80:20, and the volume ratio is spherical dioxide Silicon: polyamic acid = 73:27.).

Embodiment 2

[0215] Polystyrene particles containing spherical particles of polystyrene (PS) (median average particle diameter of 260 nm, particle size distribution index (d25 / d75) of 1.5 or less, hereinafter abbreviated as "polystyrene particles"). The dispersion liquid (40 mass %) and the aqueous solution of the polyamic acid 1 obtained above (the concentration of the polyamic acid 1: 15 mass %) were mixed, pure water was further added, and the solid content concentration was 23 mass %. The polyimide precursor solution of Example 2 was obtained (mass ratio, polystyrene particle: polyamic acid=60:40, and volume ratio, polystyrene particle: polyamic acid=68:32.).

Embodiment 3

[0217] Instead of the aqueous solution of the polyamic acid 1 obtained above (the concentration of the polyamic acid 1 was 15% by mass), the water / IPA (isopropyl alcohol) aqueous solution of the polyamic acid 1 obtained above was used (the concentration of the polyamic acid 1 was 15% by mass) Mass %, water / IPA=9 / 1 (mass ratio)), it carried out similarly to Example 2, and obtained the polyimide precursor solution of Example 3.

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Abstract

An object of the present invention is to provide a porous polyimide raw film having excellent tensile strength and bending strength, a method for producing the same, and a composition which can be suitably used for producing the same. The solution of the present invention is a porous polyimide raw film having a tensile strength of 45 MPa or more as specified in ASTM standard D638. The porous polyimide raw film comprises a polyimide containing a structural unit represented by the following formula (1-1) and a structural unit represented by the following formula (1-2). In the above formula, A11and A12 each independently represent a 4-valent aromatic group derived from an anhydride comprising an aromatic tetracarboxylic anhydride, B11 and B12 each independently represent a bivalent diamine residue derived from an aromatic diamine, and at least one selected from the group consisting of A12 and B12 contains a bivalent spacer group in its structure.

Description

technical field [0001] The present invention relates to a porous polyimide film base film excellent in tensile strength and flexural strength, a method for producing the same, and a composition that can be suitably used for the production thereof. Background technique [0002] Polyimide resins have excellent properties of mechanical strength, chemical stability, and heat resistance. Porous polyimide films formed from polyimide resins having these excellent properties have attracted attention in various applications. [0003] For example, Patent Document 1 describes a porous polyimide film that contains a polyimide resin and a non-crosslinked resin other than the polyimide resin, thereby allowing the porous polyimide film to interact with the polyimide resin. The occurrence of cracks was suppressed compared to the porous polyimide film containing only the polyimide resin. [0004] However, the porous polyimide film described in Citation 1 is fragile with respect to the forc...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L25/06C08L25/08C08K7/18C08K9/04C08K3/26C08J5/18C08J9/26C08G73/10
CPCC08J5/18C08J9/26C08G73/1042C08G73/1071C08J2379/08C08J2425/06C08J2425/08C08K7/18C08K2201/011C08K9/04C08K2003/265C08L79/08C08G73/1067
Inventor 石川薰西端巳季夫川村芳次中尾浩章
Owner TOKYO OHKA KOGYO CO LTD
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