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A kind of preparation method of temperature detection device

A technology for a temperature detection device and a substrate, which is applied to measurement devices, radiation pyrometry, electrical radiation detectors, etc., can solve the problems of high cost, low product yield, and complicated preparation process of the temperature detection device.

Active Publication Date: 2020-09-15
BEIJING NORTH GAOYE TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above-mentioned existing problems, the embodiment of the present invention provides a method for manufacturing a temperature detection device, which can solve the technical problems in the prior art that the preparation process of the temperature detection device is complicated, the cost is high, and the product yield is low.

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  • A kind of preparation method of temperature detection device
  • A kind of preparation method of temperature detection device
  • A kind of preparation method of temperature detection device

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Embodiment Construction

[0066] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0067] An embodiment of the present invention provides a method for preparing a temperature detection device. The temperature detection device prepared by the method for preparing the temperature detection device can be used for non-contact temperature detection and thermal imaging. figure 1 It is a flow chart of a method for preparing a temperature detection device provided by an embodiment of the present invention; figure 2 is corresponding figure 1 Schematic diagram of the fabrication process of the temperatu...

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Abstract

The embodiment of the invention discloses a manufacturing method of a temperature detection device. Through directly forming a bonding layer on a temperature sensing element of the temperature detection device, and based on a CIS (CMOS Image Sensor) bonding thinning process platform, a signal reading chip is bonded with a temperature sensing chip through the bonding layer by using a mixed bondingprocess and a substrate is thinned so that a manufacturing technology of the temperature detection device can be simplified, a product yield rate is increased, cost is reduced and batch production isrealized.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of temperature detection, and in particular to a method for preparing a temperature detection device. Background technique [0002] A temperature sensor is a sensor that can sense temperature and convert the sensed temperature into an output signal. According to the measurement method, temperature sensors can be divided into contact temperature sensors and non-contact temperature sensors. Among them, when the non-contact temperature sensor is measuring temperature, the sensitive element of the non-contact sensor does not touch the measured object, and can be used to measure the surface temperature of moving objects, small targets and objects with small heat capacity or rapid temperature changes (transient) and Measure the temperature distribution of the temperature field, etc. [0003] In the prior art, different functional components of the non-contact temperature sensor chip nee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J5/20
CPCG01J5/20G01J2005/202
Inventor 魏斌翟光杰翟光强
Owner BEIJING NORTH GAOYE TECH CO LTD