Graphene material directional arrangement and silica gel pad composite molding method and product

Abstract

The invention provides a graphene material directional arrangement and silica gel pad composite molding method and a thermally conductive silica gel pad product. A graphene powder material is wetted and dispersed and surface modified by adopting an organic volatilizable dilution solvent and a coupling agent. The obtained graphene dispersion liquid is added to the upper surface of a substrate pad in a spraying or coating mode. With volatilization of the organic dilution solvent, graphene can realize good directional arrangement, and excellent thermal conductivity and soaking performance of thethermally conductive pad are realized. Meanwhile, in a high-temperature vulcanization process, the coupling agent containing unsaturated groups adsorbed on the surface of graphene can generate crosslinking reaction with hydrogen-containing silicone oil and vinyl on the surface of the pad, thereby realizing firm connection between the graphene material and the raphene material directional arrangement and silica gel pad composite molding method and pad and solving the problems of defects such as insufficient strength, easy occurrence of falling off and the like in the bonding process of the graphene and the thermally conductive silica gel pad in the prior art.

Description

technical field [0001] The invention belongs to the field of thermal interface materials, and relates to a heat-conducting silica gel pad, in particular to a method for directional arrangement of graphene materials and composite molding with a silica gel pad, and a heat-conducting silica gel pad product. Background technique [0002] In the field of electronic products, with the increasing integration of electronic components, heat dissipation has become one of the bottlenecks restricting the performance of electronic products. If the temperature of electronic equipment is too high, it will lead to a significant decline in operational stability and service life. The heat generated by electronic components is often concentrated in a very limited area, and it is easy to form local hot spots. The key difficulty in heat dissipation technology is how to extract this part of the heat from the limited space, and there is an urgent need for high-performance heat-conducting materials....

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Problems solved by technology

[0005] Aiming at the above-mentioned problems in the prior art, the present invention provides a method for directional arrangement of graphene materials and composite molding with silica gel pads and heat-conducting silica gel gasket products. Wetting dispersion and surface modification of bulk materials, the obtained graphene dispersion is sprayed or coated on the upper surface of the substrate pad, and with the volatilization of organic diluent solvents, graphene can achieve good orientation and realize thermal pad Excellent thermal conductivity and heat uniformity; at the same time, during the high-temperature vulcanization process, the coupling agent containing unsaturated groups adsorbed on the surface of graphene can produce cross-linking reaction with hydrogen-containing silicone oil and vinyl on the surface of the gasket, so as to realize the relationship between graphene materials and The firm connection of the gasket solves the problem of insufficient strength and easy to produce defects such as falling off in the process of combining the existing graphene with the thermally conductive silicone gasket

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