Non-contact crack opening displacement measuring device and method for bending fracture test
A technology of opening displacement and bending fracture, which is applied in the direction of testing the strength of materials by applying a stable bending force, can solve the problems of difficulty in measuring opening displacement, increasing the difficulty of heat insulation, low-temperature dielectric loss, and limited range, etc., to achieve flexible use, Convenient bending fracture test, wide measurement range effect
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[0073] The following uses a tungsten alloy as an example to introduce the application process of the present invention.
[0074] 1. Material description: The material in the examples is tungsten alloy after deformation processing. Due to the limitations of the processing technology, larger volume blocks cannot be prepared, and conventional measurement methods cannot effectively measure the fracture toughness of the material.
[0075] 2. Test item: Fracture toughness K of brittle materials IC test.
[0076] 3. Sample type: three-point bending sample, the length is about 22mm, the span S=16mm, and the crack notch depth a is cut out in advance 0 About 1mm.
[0077] 4. Imaging system parameters: the magnification of the selected imaging lens is 2 times, and the digital resolution of the industrial camera is
[0078] 2048×1088 pixels, the physical size of a single pixel of the image collected by the optical measurement system is 2.904 μm.
[0079] 5. Test method: refer to the ...
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