An onboard airtight cooling conduction chassis

Abstract

The invention relates to an airborne closed cold guide machine box. The airborne closed cold guide machine box comprises a box body, electronic connectors and heat pipe modules, wherein an internallysealed electric cavity encircled by a cold plate and a connecting plate is formed in the box body; the inner side wall of the cold plate is integrally connected with a plurality of heat pipe modules so that the electric cavity is partitioned into a plurality of inserting passages for mounting the electronic connectors; the electronic connectors are in contact with the heat pipe modules, heat dissipation air flues and an air cavity communicating with the heat dissipation air flues are formed in the positions, corresponding to the joints of the heat pipe modules, on the outer side wall of the cold plate, and the air cavity is connected with a draught fan; on the basis of guaranteeing the airtightness of the electric cavity, due to the fact that the heat pipe modules and the electronic connectors are in one-to-one correspondence so that the contact area is increased, the heat is quickly transferred onto the cold plate through the heat pipe modules, and then the heat is discharged throughthe air cavity by the draught fan; and moreover, the heat pipe modules also can be used for carrying out uniform temperature heat dissipation on a concentrated heat source, so that the heat dissipation efficiency of the airborne closed cold guide machine box is improved greatly.

Description

technical field [0001] The invention relates to an airborne chassis, in particular to an airborne airtight cooling conduction chassis with high heat dissipation efficiency. Background technique [0002] Due to the operating environment of the bodywork aircraft, the airborne chassis must be able to withstand harsh environments such as rain, fluid pollution, sand and dust, strong vibrations, etc. In order to avoid being affected by the harsh airborne environment, the airborne chassis must adopt a sealed structure. At present, due to the high integration of electronic equipment in the airborne chassis and the large heat generated by a single electronic equipment module, the simple use of conduction cooling plus secondary air cooling can no longer meet the heat dissipation problem of high-power electronic equipment modules, and new considerations need to be considered. The structural form is to enhance the heat dissipation capacity of the airborne chassis. [0003] Therefore, h...

AI Technical Summary

Problems solved by technology

At present, due to the high integration of electronic equipment in the airborne chassis and the large heat generated by a single electronic equipment module, the simple use of conduction cooling plus secondary air cooling can no longer meet the heat dissipation problem of high-power electronic equipment modules, and new considerations need to be considered. The structural form to enhance the cooling capacity of the airborne chassis

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