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A two-component epoxy potting compound with high thermal conductivity and insulation and its application method

A potting glue, two-component technology, applied in the direction of heat exchange materials, chemical instruments and methods, adhesives, etc., can solve the problems of low thermal conductivity, poor, poor potting quality and reliability, etc., Achieve the effect of high thermal conductivity and low dielectric loss

Active Publication Date: 2021-01-05
SUZHOU TAIHU ELECTRIC ADVANCED MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the development of modern science and technology, various special motors for specific purposes have emerged as the times require, especially larger-sized motors. The coupling method realizes the servo control of the synchronous motor. This kind of motor needs to run for a long time under the condition of frequent and rapid start in both forward and reverse directions. The stator and rotor of the motor must rotate, and the windings are completely immersed in the clutch oil (AFT oil). , the operating conditions of the motor are relatively harsh, so the reliability requirements are relatively high; at the same time, for such a large-sized motor winding, due to the shrinkage of the potting compound during the curing process, the dimensional change of the potting compound is related to the iron of the motor as the temperature changes. There is a certain difference in the dimensional changes of the core and the winding. The larger the workpiece size, the larger the absolute value of this difference, resulting in more serious cracking.
For example, the potting adhesives produced by some domestic manufacturers, including some products produced by imported technology, mostly have cracking problems, and some potting adhesives have cracked even before curing; although the high thermal conductivity epoxy potting adhesives produced by some foreign companies Good anti-crack performance, but the viscosity of the material is as high as 4000mPa s (65°C), the resin fluidity is very poor, and the service life is less than 0.5h. For larger motors, there is not enough time to complete vacuum defoaming and Vacuum potting and other operations lead to a large number of air bubbles and air gaps remaining inside the workpiece, and the quality and reliability of potting cannot be guaranteed
[0004] At the same time, the thermal conductivity of potting adhesives is still insufficient. For example, the Chinese invention patent CN103773298B discloses a high-thermal-conductivity insulating adhesive for high-power LED lamps and a preparation method thereof. The rate is still low, and the thermal conductivity does not exceed 6.6W (m / k)
Another example is the Chinese invention patent CN103087665B, which discloses a high-thermal-conductivity insulating low-viscosity epoxy resin potting compound and its preparation method. It is about 2.0W (m / k), and at the same time it is added as high as 10-13 times the amount of epoxy resin, the cost is high, and it is not conducive to the physical and mechanical properties and processability of the encapsulant

Method used

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  • A two-component epoxy potting compound with high thermal conductivity and insulation and its application method
  • A two-component epoxy potting compound with high thermal conductivity and insulation and its application method
  • A two-component epoxy potting compound with high thermal conductivity and insulation and its application method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] The preparation of compound shown in embodiment 1 formula (Ia) (that is R in formula (I) 0 for propyl)

[0062] The preparation of the compound shown in formula (Ia): take by weighing 15.8g (0.073mol) N-butylpyridinium bromide salt ([bpy]Br) and 8g (0.073mol) (sodium tetrafluoroborate) NaBF 4 In a plastic washing bottle, add 100 mL of acetone as a solvent, stir magnetically, condense and reflux at room temperature, react for 12 hours, let stand, filter under reduced pressure, discard the white solid NaBr, and obtain a light yellow clear filter night, and filter to a light yellow clear Add 100mL of dichloromethane to the solution, and a white precipitate precipitates out. Suction filtration under reduced pressure, and the filter is concentrated by rotary evaporation to remove acetone and dichloromethane. The obtained yellow oily liquid is vacuum-dried at 60°C for 8 hours to obtain the product formula (Ia ) Compound [bpy]BF 4 13.8g, yield 85.2%;

[0063]

Embodiment 2

[0064] Compound shown in embodiment 2 formula (Ib) (i.e. R in formula (I) 0 For the preparation of methyl)

[0065] The preparation of compound shown in formula (Ib): 28.2g (0.15mol) N-ethylpyridine bromide is added in the Erlenmeyer flask that fills 50mL acetone, adds 16.5g (0.15mol) NaBF 4 , magnetic stirring at room temperature for 10 h, filtration, rotary evaporation, removal of volatile acetone, and vacuum drying to obtain 25.16 g of the compound represented by formula (Ib) as a white solid, with a yield of 86.5%, m.p.53.2-53.6°C;

[0066]

Embodiment 3

[0067] The preparation of the curing accelerator adopted in embodiment 3 following examples

[0068] The structural formula of curing accelerator is as follows:

[0069]

[0070] The synthetic route is as follows:

[0071]

[0072] Its preparation method includes:

[0073](1) Synthesis of all aromatic complex dibasic acids

[0074] Add 414g of p-hydroxybenzoic acid, 100g of sodium hydroxide, and distilled water into a 2000mL three-neck bottle in sequence, stir to dissolve, add 304.5g of terephthaloyl chloride in carbon tetrachloride solution dropwise under high-speed stirring, and dropwise add in about 4 hours. Completed, continue to react for 4 h under high-speed stirring, stop the reaction, filter with suction, wash until neutral, then acidify with 36% hydrochloric acid for 2 h, filter the product with suction, wash with distilled water until neutral, dehydrate with acetone, and place in a vacuum oven for 80 After drying at ℃ for 18 hours, 520 g of all-aromatic comp...

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Abstract

The invention discloses a two-component epoxy potting glue and its use method, comprising A and B components, A component includes modified epoxy resin, diluent and thermal conductive filler, B component includes curing agent, curing accelerator The raw materials of modified epoxy resin include epoxy resin matrix, vinyl monomer containing ester group, and hydrophobic hexagonal boron nitride nanosheets containing vinyl group. Modified epoxy resin is composed of epoxy resin matrix and remaining raw materials It is made by polymerization reaction, and boron nitride nanosheets are prepared by a specific method: surface hydroxyl modification, freeze-thaw expansion treatment, combined with specific compound one-pot method for boron nitride peeling and esterification modification Catalysis; use: mix components A and B first, then vacuum defoam several times after mixing, and solidify in stages at different temperatures; the potting adhesive of the present invention can combine excellent electrical properties and mechanical properties With low viscosity, good flow permeability, high thermal conductivity, low linear expansion coefficient, high heat resistance and other properties.

Description

technical field [0001] The invention belongs to the technical field of polymer composite materials and electrical engineering, and in particular relates to a high thermal conductivity and insulating epoxy potting glue and its application method. Background technique [0002] Epoxy resin is a kind of organic polymer compound containing 2 or more epoxy groups in a molecule, which has the characteristics of excellent electrical insulation, chemical corrosion resistance, strong adhesion, flexible and diverse formula design, and No small molecular by-products are produced during the curing process, the cured product has good dimensional stability, low equipment requirements, and good manufacturability. The high-performance epoxy potting adhesive prepared by epoxy resin can effectively strengthen the integrity of electronic components and improve the protection against foreign substances. Shock and vibration resistance, maintain the insulation performance of electronic components,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J151/08C09J151/10C08F283/10C08F292/00C08F220/14C08G59/68C09K5/14
CPCC09J151/08C09J151/10C08F283/10C08F292/00C08G59/686C09K5/14C08K2003/385C08L2201/08C08L2203/20C08K9/00C08K3/36C08K3/38C08F220/14C08F220/1804
Inventor 景录如张春琪吴斌崔益华夏智峰胡晓丹井丰喜
Owner SUZHOU TAIHU ELECTRIC ADVANCED MATERIAL CO LTD
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